Micro/Nano Hierarchical Crater-Like Structure Surface With Mechanical Durability and Low-Adhesion for Anti-Icing/Deicing
Sensen Xuan
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorLijie Zhuo
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorCorresponding Author
Guoqiang Li
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorQin Zeng
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorJiasong Liu
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorCorresponding Author
Jiaxin Yu
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorLiang Chen
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorYi Yang
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorSenyun Liu
Key Laboratory of Icing and Anti/Deicing, China Aerodynamics Research and Development Center, Mianyang, 621000 P. R. China
Search for more papers by this authorYuan Wang
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorCorresponding Author
Kai Yin
Hunan Key Laboratory of Nanophotonics and Devices, School of Physics, Central South University, Changsha, 410083 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorSensen Xuan
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorLijie Zhuo
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorCorresponding Author
Guoqiang Li
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorQin Zeng
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorJiasong Liu
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorCorresponding Author
Jiaxin Yu
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorLiang Chen
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorYi Yang
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorSenyun Liu
Key Laboratory of Icing and Anti/Deicing, China Aerodynamics Research and Development Center, Mianyang, 621000 P. R. China
Search for more papers by this authorYuan Wang
School of Manufacture Science and Engineering, School of Information Engineering, Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Mianyang, 621010 P. R. China
Search for more papers by this authorCorresponding Author
Kai Yin
Hunan Key Laboratory of Nanophotonics and Devices, School of Physics, Central South University, Changsha, 410083 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorAbstract
Superhydrophobic surfaces have attracted significant attention for their ability to prevent ice formation and facilitate deicing without requiring external energy. However, these surfaces are often vulnerable to damage from external forces, leading to functional failure due to poor mechanical stability, which limits their widespread use. Drawing inspiration from the hierarchical groove of rose petals and the micropapillae of lotus leaves, a simple laser-based method is proposed to create a superhydrophobic surface with a micro/nano hierarchical crater-like structure (HCLS). To enhance the surface, boiling water treatment is applied to induce dense nanostructures, resulting in an optimal contact angle (CA) of 162° and a desirable sliding angle (SA) of 2.0°. The initial ice adhesion strength of HCLS is as low as 1.4 kPa and remains below 10 kPa even after 300 cm sandpaper abrasion. Furthermore, the HCLS demonstrates excellent mechanical durability, maintaining its performance under conditions that simulate the continuous impact of water and sand in extreme weather. This approach offers an innovative design concept that has the potential to advance the development of anti-icing and deicing surfaces for future aircraft.
Conflict of Interest
The authors declare no conflict of interest.
Open Research
Data Availability Statement
The data that support the findings of this study are available in the supplementary material of this article.
Supporting Information
Filename | Description |
---|---|
smll202404979-sup-0001-SuppMat.docx10.7 MB | Supporting Information |
smll202404979-sup-0002-MovieS1.avi3.6 MB | Supplemental Movie1 |
smll202404979-sup-0003-MovieS2.avi4.4 MB | Supplemental Movie2 |
smll202404979-sup-0004-MovieS3.avi3.4 MB | Supplemental Movie3 |
smll202404979-sup-0005-MovieS4.avi3.7 MB | Supplemental Movie4 |
smll202404979-sup-0006-MovieS5.avi4.6 MB | Supplemental Movie5 |
Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.
References
- 1a) X. Li, B. Zhan, X. Wang, Y. Liu, Y. Liu, J. Leng, Compos. Sci. Technol. 2024, 247, 110398; b) X. Zeng, H. Ong, L. Haworth, Y. Lu, D. Yang, M. Rahmati, Q. Wu, H. Torun, J. Martin, X. Hou, X. Lv, W. Yuan, Y. He, Y. Fu, ACS Appl. Mater. Interfaces 2023, 15, 35648.
- 2a) O. M. Stefaniak, S. R. Corsi, T. D. Rutter, G. G. Failey, Environ. Sci. Technol. 2023, 57, 17051;
b) O. Tamer, A. Kyriazis, M. Sinapius, Smart Mater. Struct. 2020, 29, 045021;
10.1088/1361-665X/ab74bc Google Scholarc) P. Talalay, N. Liu, Y. Yang, H. Xu, M. Sysoev, X. Fan, Polar. Sci. 2019, 19, 49;10.1016/j.polar.2018.08.005 Google Scholard) R. Li, S. Tian, Y. Tian, J. Wang, S. Xu, K. Yang, J. Yang, L. Zhang, Small 2023, 19, 2206075; e) Z. He, K. Liu, J. Wang, Acc. Chem. Res. 2018, 51, 1082.
- 3a) W. Huang, B. Nelson, S. Tian, R. Ordikhani-Seyedlar, R. C. Y. Auyeung, A. Samanta, H. Hu, S. Shaw, C. Lamuta, H. Ding, Appl. Mater. Today 2022, 29, 101630;
10.1016/j.apmt.2022.101630 Google Scholarb) M. W. Miller, M. Parkinson, A. Dato, ACS Mater. Lett. 2022, 4, 995; c) L. Wang, C. Zhang, Z. Wei, Z. Xin, ACS Nano 2023, 18, 526; d) P. Zhou, H. Yu, Y. Zhong, W. Zou, Z. Wang, L. Liu, Nano-Micro Lett. 2020, 12, 166.
- 4C. Chen, Z. Tian, X. Luo, G. Jiang, X. Hu, L. Wang, R. Peng, H. Zhang, M. Zhong, Chem. Eng. J. 2022, 450, 137936.
- 5a) L. Wang, D. Li, G. Jiang, X. Hu, R. Peng, Z. Song, H. Zhang, P. Fan, M. Zhong, ACS Nano 2024, 18, 12489; b) H. Zhang, G. Zhao, S. Wu, Y. Alsaid, W. Zhao, X. Yan, L. Liu, G. Zou, J. Lv, X. He, Z. He, J. Wang, Proc. Natl. Acad. Sci. USA 2021, 118, 2100978118.
- 6S. Xuan, H. Yin, G. Li, Z. Zhang, Y. Jiao, Z. Liao, J. Li, S. Liu, Y. Wang, C. Tang, W. Wu, G. Li, K. Yin, ACS Nano 2023, 17, 21749.
- 7J. Chen, Z. Luo, R. An, P. Marklund, M. Björling, Y. Shi, Small 2022, 18, 2200532.
- 8N. Cohen, A. Dotan, H. Dodiuk, S. Kenig, Mater. Manuf. Process. 2016, 31, 1143.
- 9Z. Chen, C. Wu, H. Zhou, G. Zhang, H. Yan, Surf. Coat. Tech. 2022, 444, 128673.
- 10L. B. Boinovich, A. M. Emelyanenko, K. A. Emelyanenko, E. B. Modin, ACS Nano 2019, 13, 4335.
- 11a) Y. Chen, H. Wu, R. Li, S. Jiang, S. Zhou, Z. Cui, Y. Tao, X. Zheng, Q. Zhang, J. Li, G. Li, D. Wu, J. Chu, Y. Hu, Int. J. Extrem. Manuf. 2024, 6, 025503;
10.1088/2631-7990/ad23ee Google Scholarb) J. Yong, X. Li, Y. Hu, Y. Peng, Z. Cheng, T. Xu, C. Wang, D. Wu, Int. J. Extrem. Manuf. 2024, 6, 035002; c) L. Wang, K. Yin, Q. Deng, Q. Huang, J. He, J. A. Duan, Adv. Sci. 2022, 9, 2204891; d) Q. Huang, Y. He, K. Yin, H. Zhang, P. Yang, G. Li, S. U. Awan, A. S. G. Khalil, Appl. Phys. Lett. 2024, 125, 031601; e) Y. He, K. Yin, L. Wang, T. Wu, Y. Chen, C. J. Arnusch, Appl. Phys. Lett. 2024, 124, 171601.
- 12Z. Guo, W. Liu, Plant Sci. 2007, 172, 1103.
- 13Z. Zhang, M. Y. Ha, J. Jang, Nanoscale 2017, 9, 16200.
- 14D. Wang, Q. Sun, M. J. Hokkanen, C. Zhang, F.-Y. Lin, Q. Liu, S. P. Zhu, T. Zhou, Q. Chang, B. He, Q. Zhou, L. Chen, Z. Wang, R. H. A. Ras, X. Deng, Nature 2020, 582, 55.
- 15a) W. Huang, J. Huang, Z. Guo, W. Liu, Adv. Colloid Interface Sci. 2022, 304, 102658; b) K. Yin, L. Wang, Q. Deng, Q. Huang, J. Jiang, G. Li, J. He, Nano-Micro Lett. 2022, 14, 97.
- 16L. Wang, Z. Tian, G. Jiang, X. Luo, C. Chen, X. Hu, H. Zhang, M. Zhong, Nat. Commun. 2022, 13, 378.
- 17a) A. K. Kota, G. Kwon, A. Tuteja, NPG Asia Mater 2014, 6, e109; b) W. Choi, A. Tuteja, S. Chhatre, J. M. Mabry, R. E. Cohen, G. H. McKinley, Adv. Mater. 2009, 21, 2190.
- 18S. S. Chhatre, W. Choi, A. Tuteja, K. C. Park, J. M. Mabry, G. H. McKinley, R. E. Cohen, Langmuir 2009, 26, 4027.
10.1021/la903489r Google Scholar
- 19a) T. V. Charpentier, A. Neville, P. Millner, R. W. Hewson, A. Morina, J. Colloid Interf. Sci. 2013, 394, 539; b) Y. Yamada, G. Onishi, A. Horibe, Langmuir 2019, 35, 16401.
- 20a) S. Xuan, H. Yin, G. Li, Y. Yang, Y. Wang, J. Liu, S. Liu, X. Li, Y. Song, T. Wu, K. Yin, Mater. Horiz. 2024, 11, 3561; b) L. Wang, K. Yin, Q. Deng, Q. Huang, C. J. Arnusch, Carbon 2024, 219, 118824.
- 21a) M. Zhou, L. Zhang, L. Zhong, M. Chen, L. Zhu, T. Zhang, X. Han, Y. Hou, Y. Zheng, Adv. Mater. 2024, 36, 2305322; b) Z. Zhao, Y. Wang, Z. Wang, X. Cui, G. Liu, Y. Zhang, Y. Zhu, J. Chen, S. Sun, K. Zhang, X. Liu, H. Chen, Small 2024, 20, 2311435; c) H. Xie, W. H. Xu, Y. Du, J. Gong, R. Niu, T. Wu, J. P. Qu, Small 2022, 18, 2200175.
- 22a) S. Jia, X. Lu, S. Luo, Y. Qing, N. Yan, Y. Wu, Chem. Eng. J. 2018, 348, 212; b) H. Wang, M. He, H. Liu, Y. Guan, ACS Appl. Mater. Interfaces 2019, 11, 25586; c) N. Celik, I. Torun, M. Ruzi, A. Esidir, M. S. Onses, Chem. Eng. J. 2020, 396, 125230; d) H. Zhou, R. Chen, Q. Liu, J. Liu, J. Yu, C. Wang, M. Zhang, P. Liu, J. Wang, Chem. Eng. J. 2019, 368, 261; e) W. Li, F. Wang, Z. Li, Colloid. Surface. A 2021, 630, 127570; f) X. Liu, X. Zhang, Q. Chen, Y. Pan, C. Liu, C. Shen, Chem. Eng. J. 2021, 406, 126532; g) R. Pan, M. Cai, W. Liu, X. Luo, C. Chen, H. Zhang, M. Zhong, J. Laser Appl. 2020, 32, 022047.
- 23a) S. Lee, M. J. Bae, E. J. Seo, J. Lyu, S.-H. Lee, Y. J. Jung, H. Jung, Y. I. Park, J. C. Kim, J. E. Jeong, Prog. Org. Coat. 2024, 189, 108298; b) W. Zhao, L. Xiao, X. He, Z. Cui, J. Fang, C. Zhang, X. Li, G. Li, L. Zhong, Y. Zhang, Opt. Laser Technol. 2021, 141, 107115; c) X. He, G. Li, Y. Zhang, X. Lai, M. Zhou, L. Xiao, X. Tang, Y. Hu, H. Liu, Y. Yang, Y. Cai, L. Guo, S. Liu, W. Zhao, Chem. Eng. J. 2021, 416, 129113.