Volume 133, Issue 11 pp. 5993-6000
Forschungsartikel

Stabilization of Undercooled Metals via Passivating Oxide Layers

Andrew Martin

Andrew Martin

Department of Materials Science and Engineering, Iowa State University, Ames, IA, 50010 USA

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Boyce S. Chang

Boyce S. Chang

Department of Materials Science and Engineering, Iowa State University, Ames, IA, 50010 USA

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Alana M. Pauls

Alana M. Pauls

Department of Materials Science and Engineering, Iowa State University, Ames, IA, 50010 USA

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Chuanshen Du

Chuanshen Du

Department of Materials Science and Engineering, Iowa State University, Ames, IA, 50010 USA

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Martin Thuo

Corresponding Author

Martin Thuo

Department of Materials Science and Engineering, Iowa State University, Ames, IA, 50010 USA

Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, 50010 USA

Micro-Electronics Research Centre, Ames, IA, 50014 USA

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First published: 30 December 2020
Citations: 3

Abstract

Undercooling metals relies on frustration of liquid–solid transition mainly by an increase in activation energy. Passivating oxide layers are a way to isolate the core from heterogenous nucleants (physical barrier) while also raising the activation energy (thermodynamic/kinetic barrier) needed for solidification. The latter is due to composition gradients (speciation) that establishes a sharp chemical potential gradient across the thin (0.7–5 nm) oxide shell, slowing homogeneous nucleation. When this speciation is properly tuned, the oxide layer presents a previously unaccounted for interfacial tension in the overall energy landscape of the relaxing material. We demonstrate that 1) the integrity of the passivation oxide is critical in stabilizing undercooled particle, a key tenet in developing heat-free solders, 2) inductive effects play a critical role in undercooling, and 3) the magnitude of the influence of the passivating oxide can be larger than size effects in undercooling.

Conflict of interest

The authors declare no conflict of interest.

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