The simple production of micro/nanoscale patterns with very high aspect ratios exceeding that of the mold used is demonstrated using unconventional top-surface lithography. The method combines inkless contact printing and subsequent dry pattern development by oxygen reactive ion etching (see image), making it possible to form high-resolution, high-aspect-ratio patterns without the aid of expensive optical protocols.

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Volume6, Issue3

February 5, 2010

Pages 371-375

High-Aspect-Ratio Imageable Top-Surface Lithography Using UV-Assisted Inkless Contact Printing

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High-Aspect-Ratio Imageable Top-Surface Lithography Using UV-Assisted Inkless Contact Printing

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