Volume 12, Issue 8 pp. 1085-1089
Contributed Article

Materials characterization and device analysis for evaluation of semiconductor processes by highly-sophisticated photoelastic stress measurement technique

Martin Herms

Corresponding Author

Martin Herms

PVA TePla Metrology Systems GmbH, Im Naßtal 6/8, 07751 Jena-Maua, Germany

Phone: +00 49 364161389 851, Fax: +00 49 364161389 50Search for more papers by this author
Matthias Wagner

Matthias Wagner

PVA TePla Metrology Systems GmbH, Im Naßtal 6/8, 07751 Jena-Maua, Germany

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Alexander Molchanov

Alexander Molchanov

PVA TePla AG, Im Westpark 10-12, 35435 Wettenberg, Germany

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Pinyen Lin

Pinyen Lin

Global 450mm Consortium, Albany, NY 12203, USA

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Ingrid De Wolf

Ingrid De Wolf

imec, Kapeldreef 75, 3001 Leuven, Belgium

Department MTM, Faculty of Engineering Science, KU Leuven, 3000 Leuven, Belgium

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Ming Zhao

Ming Zhao

imec, Kapeldreef 75, 3001 Leuven, Belgium

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First published: 11 May 2015
Citations: 5

Abstract

SIRD (Scanning Infrared Depolarization Imager) and SIREX (Scanning Infrared Stress Explorer) are measurement systems to evaluate and visualize the stress distribution in semiconductor materials and devices. Some main fields of application are crystal growth, high temperature processing of silicon wafers as well as the 3D-structuring of silicon-based microelectronic devices. The used strategies of measurement are different. SIRD and SIREX are equipped with versatile software packages that allow to separate defect-related stress states of interest, for instance slip-lines in GaN-overgrown silicon. Micro-holes fabricated for wafer marking and 3D TSV (through silicon vias) structures have been analyzed with micrometer resolution. (© 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

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