Volume 42, Issue 3 2000499
Communication

Green Fabrication of Highly Conductive Paper Electrodes via Interface Engineering with Aminocellulose

Yang Yang

Yang Yang

State Key Laboratory of Pulp and Paper Engineering, South China University of Technology, Guangzhou, 510640 China

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Quanbo Huang

Quanbo Huang

State Key Laboratory of Pulp and Paper Engineering, South China University of Technology, Guangzhou, 510640 China

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Wenjiao Ge

Wenjiao Ge

State Key Laboratory of Pulp and Paper Engineering, South China University of Technology, Guangzhou, 510640 China

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Junli Ren

Junli Ren

State Key Laboratory of Pulp and Paper Engineering, South China University of Technology, Guangzhou, 510640 China

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Thomas Heinze

Corresponding Author

Thomas Heinze

Institute of Organic Chemistry and Macromolecular Chemistry, Friedrich Schiller University of Jena, Centre of Excellence for Polysaccharide Research, Humboldtstraße 10, Jena, D-07743 Germany

E-mail: [email protected]; [email protected]

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Xiaohui Wang

Corresponding Author

Xiaohui Wang

State Key Laboratory of Pulp and Paper Engineering, South China University of Technology, Guangzhou, 510640 China

E-mail: [email protected]; [email protected]

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First published: 16 November 2020
Citations: 4

Abstract

Herein, a novel, facile, and versatile approach to fabricate highly flexible and conductive paper is proposed by electroless deposition (ELD) with the assistance of aminocellulose as the interface layer. The obtained Cu nanoparticles (NPs)-coated cellulose paper is highly conductive with a significant low resistance of 0.38 Ω sq−1 after only 10 min of ELD treatment. This conductive cellulose paper shows excellent stability when it suffers from bending, folding, and tape adhesion cycles. With the same method, the Cu NPs can also be successfully deposited on the polypropylene (PP)-filled hybrid paper. The conductive paper exhibits very smooth and hydrophobic surface with high reflection, which can be used for special electronic devices. In a word, the fabrication of aminocellulose interface permits a controlled ELD of metal nanoparticles on paper substrate, and this mild and low-cost method opens up new opportunities for large-scale production of flexible and wearable electronics.

Conflict of Interest

The authors declare no conflict of interest.

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