Metal Surface Micromachining

Minoru Sasaki

Toyota Technological Institute, Department of Advanced Science and Technology, 2–12–1 Hisakata, Tenpaku-ku, Nagoya, 468-8511 Japan

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Minoru Sasaki,

Minoru Sasaki

Toyota Technological Institute, Department of Advanced Science and Technology, 2–12–1 Hisakata, Tenpaku-ku, Nagoya, 468-8511 Japan

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Book Editor(s):Masayoshi Esashi,

Masayoshi Esashi

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First published: 23 April 2021

https://doi.org/10.1002/9783527823239.ch6

Summary

The typical surface micromachining uses polysilicon (poly Si) as the structure material. There is the residual stress in the deposited poly Si film. There are some devices fabricated by the metal surface micromachining including the company products at present. The relatively thick metal lines are fabricated starting from the preparation of the sacrificial mold followed by the electroplating of the metal. One version of the metal surface micromachining is making the layer thin ultimately. The plastic deformation of the metal layer is reported to tune micro electro mechanical system (MEMS) layer after the fabrication. MEMS switch structure has the source, gate, and drain electrodes. The digital micromirror device developed by Texas Instruments, Inc. is a unique MEMS device mainly used in the projection display. The standard complementary metal oxide semiconductor circuit has metal lines for connecting the transistors and the gathered units. The variety of structures can be built by changing the mask design.

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3D and Circuit Integration of MEMS