Vacuum Packaging

Masayoshi Esashi,

Masayoshi Esashi

Tohoku University, Micro System Integration Center (μSIC), 519-1176 Aramaki-Aza-Aoba, Aoba-ku, 980-0845, Sendai, Japan

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Masayoshi Esashi,

Masayoshi Esashi

Tohoku University, Micro System Integration Center (μSIC), 519-1176 Aramaki-Aza-Aoba, Aoba-ku, 980-0845, Sendai, Japan

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Book Editor(s):Masayoshi Esashi,

Masayoshi Esashi

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First published: 23 April 2021

https://doi.org/10.1002/9783527823239.ch18

Summary

The vacuum packaging can be made by anodic bonding in a vacuum chamber. However oxygen gas is generated from the glass at the bonding interface. Sensors such as capacitive accelerometer requires controlled optimum cavity pressure to prevent a viscous dumping at low vacuum and a resonance at high vacuum. The sensor array is packaged using a Si lid, which has anti-reflective coating on both sides. These are sealed in vacuum by metal bonding using solder. Vacuum cavity can be made by sealing with deposited material. The cavity vacuum having a Si resonator is fabricated in a Si diaphragm. The hermeticity of the micro electro mechanical systems (MEMS) cavity has to be tested. A sample of MEMS package kept in a chamber filled with He gas is transferred into the integration chamber.

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3D and Circuit Integration of MEMS