Reactive Bonding
Klaus Vogel
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorSilvia Braun
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorChristian Hofmann
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorMathias Weiser
Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorMaik Wiemer
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorThomas Otto
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorHarald Kuhn
Electrochemistry, Fraunhofer Institute for Ceramic Technologies and Systems, Winterbergstraβe 28, 01277 Dresden, Germany
Search for more papers by this authorKlaus Vogel
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorSilvia Braun
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorChristian Hofmann
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorMathias Weiser
Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorMaik Wiemer
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorThomas Otto
Department System Packaging, Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for more papers by this authorHarald Kuhn
Electrochemistry, Fraunhofer Institute for Ceramic Technologies and Systems, Winterbergstraβe 28, 01277 Dresden, Germany
Search for more papers by this authorMasayoshi Esashi
Search for more papers by this authorSummary
Reactive material systems (RMS) are a new energetic material for wafer bonding application. They have a well-defined heterogeneous structure. While particle and foil-based RMS only have limited relevance for microelectronics, thin film layers show a great potential as energy source for chip and wafer boning. Reactive material thin films generate energy based on a self-propagating high temperature reaction. Further developments focus on the transfer of the reactive bonding process from component to wafer level. A homogeneous deposition of RMS is essential for the development of a bonding process on chip and wafer level. Physical vapor deposition (PVD) can be used for the deposition of various RMS. The deposition of reactive multilayers by PVD enables a homogeneous and uniform coating of chips and wafers with a large variety of material systems. Bonding based on RMS utilizes a self-propagating reaction to form a stable bond between two substrates.
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