Chapter 6
Electrical Design for 5G Hardware—RF Focus
Professor Lih-Tyng Hwang,
Professor Tzyy-Sheng Jason Horng,
Professor Lih-Tyng Hwang
Department of Electrical Engineering and Institute of Communications Engineering, National Sun Yat-Sen University, Kaohsiung, Taiwan
Search for more papers by this authorProfessor Tzyy-Sheng Jason Horng
Department of Electrical Engineering and Institute of Communications Engineering, National Sun Yat-Sen University, Kaohsiung, Taiwan
Search for more papers by this authorBook Author(s):Professor Lih-Tyng Hwang,
Professor Tzyy-Sheng Jason Horng,
Professor Lih-Tyng Hwang
Department of Electrical Engineering and Institute of Communications Engineering, National Sun Yat-Sen University, Kaohsiung, Taiwan
Search for more papers by this authorProfessor Tzyy-Sheng Jason Horng
Department of Electrical Engineering and Institute of Communications Engineering, National Sun Yat-Sen University, Kaohsiung, Taiwan
Search for more papers by this authorSummary
This chapter discusses the RF-passives, and electro-magnetic interference (EMI)/electro-magnetic compatibility (EMC). It focuses on the basics and design of antenna, followed by design of RF function circuits in RF modules, or RF SiPs, for example, bandpass filters, baluns, switches and duplexers, which considered critical components to fulfill the tasks of wireless functions and multi-mode multi-band (MMMB). The chapter presents the discussion on hardware platform used to realize active-integrated antennas and the issue associated with the hardware design. Beside antennas, RF transceiver and many RF modules hardware can be found in RF front-end. They perform MMMB functionalies, but, from hardware point of view, they perform filtering, balun (balance-unbalance) transforming, switching, duplexing, and power envelope tracking functions. Future wireless communication standard, 5G, has a simple goal: to reach a data rate of 10 Gbps in year 2020.
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