Phase-Change Memory: A Historic Perspective
Mattia Boniardi
Technology R&D, STMicroelectronics, via C. Olivetti 2, 20864 Agrate Brianza, Italy
Search for more papers by this authorCorresponding Author
Andrea Redaelli
Technology R&D, STMicroelectronics, via C. Olivetti 2, 20864 Agrate Brianza, Italy
Search for more papers by this authorMattia Boniardi
Technology R&D, STMicroelectronics, via C. Olivetti 2, 20864 Agrate Brianza, Italy
Search for more papers by this authorCorresponding Author
Andrea Redaelli
Technology R&D, STMicroelectronics, via C. Olivetti 2, 20864 Agrate Brianza, Italy
Search for more papers by this authorAbstract
The phase-change memory (PCM) technology is one of the most studied emerging technologies for both the stand-alone and embedded memory markets. It is based on the peculiar properties of a chalcogenide material, able to make reversible transitions between a poly-crystalline, high conductivity phase, and an amorphous, high resistivity phase, thus enabling the storage of the logical bit. PCM allows for an analog-oriented storage as well, opening the way to an employment on inference for AI applications. The research on PCM began in the late 1960s, driven by the pioneering work of Stanford Ovshinsky, who discovered the threshold and memory switching effects in amorphous materials. An overview of the early work, the cell and array demonstrators all the way to more recent implementations of PCM proves the depth of the research done on this technology. The implementation of different cell architectures and the research on the core material represent the key points for PCM development.
Conflict of Interest
The authors declare no conflict of interest.
References
- 1D. Frohman-Bentchkowsky, in 1971 IEEE Int. Solid-State Circuits Conf. Digest of Technical Papers, Vol. XIV, Philadelphia, PA, USA 1971, pp. 80–81.
- 2H.-S. P. Wong, S. Salahuddin, Nat. Nanotechnol. 2015, 10, 191.
- 3R. Bez, E. Camerlenghi, A. Modelli, A. Visconti, Proc. IEEE 2003, 91, 489.
- 4H. Iizuka, F. Masuoka, T. Sato, M. Ishikawa, IEEE Trans. Electron Devices 1976, 23, 379.
- 5F. Masuoka, M. Asano, H. Iwahashi, T. Komuro, S. Tanaka, in 1984 Int. Electron Devices Meeting San Francisco, CA, USA 1984, pp. 464–467.
- 6S. Lai, in Int. Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217) 1998,San Francisco, CA, USA, pp. 971–973.
- 7S. Yu, T.-H. Kim, Computer 2024, 57, 150.
- 8D. U. Lee, K. W. Kim, K. W. Kim, H. Kim, J. Y. Kim, Y. J. Park, J. H. Kim, D. S. Kim, H. B. Park, J. W. Shin, J. H. Cho, K. H. Kwon, M. J. Kim, J. Lee, K. W. Park, B. Chung, S. Hong, in 2014 IEEE Int. Solid-State Circuits Conf. Digest of Technical Papers (ISSCC) San Francisco, CA, USA 2014, pp. 432–433.
- 9S. Mukherjee, T. Chang, R. Pang, M. Knecht, D. Hu, in 1985 Int. Electron Devices Meeting, Washington, DC, USA 1985, pp. 616–619.
- 10F. Masuoka, M. Momodomi, Y. Iwata, R. Shirota, in 1987 Int. Electron Devices Meeting, Washington, DC, USA 1987, pp. 552–555.
- 11M. A. Lantz, S. Furrer, M. Petermann, H. Rothuizen, S. Brach, L. Kronig, I. Iliadis, B. Weiss, E. R. Childers, D. Pease, ACM Trans. Storage 2025, 21, 1.
- 12C. Kuo, T. Toms, M. Weidner, H. Choe, D. Shum, K.-M. Chang, P. Smith, in Proc. 4th Int. Conf. Solid-State and IC Technology, Beijing, China 1995, pp. 138–140.
- 13B. Chen, J. Wan, A. Celesti, D. Li, H. Abbas, Q. Zhang, IEEE Commun. Mag. 2018, 56, 103.
- 14S. U. Amin, M. S. Hossain, IEEE Access 2021, 9, 45.
- 15T. Yamauchi, Y. Yamaguchi, T. Kono, H. Hidaka, in 2016 IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, USA 2016, pp. 28.6.1–28.6.4.
- 16H. Hidaka, in IEEE Int. Conf. IC Design and Technology, Kaohsiung, Taiwan 2011, pp. 1–4.
- 17W. Shi, S. Dustdar, Computer 2016, 49, 78.
- 18S. S. Iyer, V. Roychowdhury, Science 2023, 382, 263.
- 19Y. Li, IEEE Solid-State Circuits Mag. 2020, 12, 56.
- 20A. Goda, Electronics 2021, 10, 24.
- 21R. Richter, M. Trentzsch, S. Dünkel, J. Müller, P. Moll, B. Bayha, K. Mothes, A. Henke, M. Mazur, J. Paul, P. Krottenthaler, J. Poth, S. Jansen, R. Hüselitz, H. Kim, A. Zaka, T. Herrmann, E. Bazizi, S. Beyer, P. Ghazavi, H. Om'mani, S. Lemke, Y. Tkachev, F. Zhou, J. Kim, X. Liu, V. Tiwari, N. Do, in 2018 IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, USA 2018, pp. 18.5.1–18.5.4.
- 22P. Zuliani, A. Conte, P. Cappelletti, in 2019 Symp. VLSI Technology, Kyoto, Japan 2019, pp. T192–T193.
- 23C. H. Lam, in 2010 10th IEEE Int. Conf. Solid-State and Integrated Circuit Technology, Shanghai, China 2010, pp. 1080–1083.
- 24S. W. Fong, C. M. Neumann, H.-S. P. Wong, IEEE Trans. Electron Devices 2017, 64, 4374.
- 25F. Arnaud, P. Ferreira, F. Piazza, A. , P. Zuliani, P. Mattavelli, E. Gomiero, G. Samanni, J. Jasse, C. Jahan, J. P. Reynard, R. Berthelon, O. Weber, A. Villaret, B. Dumont, J. C. Grenier, R. Ranica, C. Gallon, C. Boccaccio, A. Souhaite, L. Desvoivres, D. Ristoiu, L. Favennec, V. Caubet, S. Delmedico, N. Cherault, R. Beneyton, S. Chouteau, P. O. Sassoulas, L. Clement, et al., 2020 IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, USA 2020, pp. 24.2.1–24.2.4.
- 26S. Ko, J. H. Park, J. H. Bak, H. Jung, J. Shim, D. S. Kim, W. Lim, D.-E. Jeong, J. H. Lee, K. Lee, J.-H. Park, Y. Kim, C. Kim, J. H. Jeong, C. Y. Lee, S. H. Han, Y. Ji, S. H. Hwang, H. J. Shin, K. Lee, Y. J. Song, Y. G. Shin, J. H. Song, in 2023 IEEE Symp. VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan 2023, pp. 1–2.
- 27C.-Y. Wu, C.-F. Yang, C.-W. Lai, Y.-T. Wu, T.-C. Chien, M.-H. Yang, M.-T. Yang, Y.-N. Kao, C.-L. Cheng, C.-Y. Wang, H. W. Tseng, Y.-D. Chih, W.-T. Chu, A. Hung, W. H. Chuang, in 2023 Int. Electron Devices Meeting (IEDM), San Francisco, CA, USA 2023, pp. 1–4.
- 28F. Arnaud, P. Zuliani, J. Reynard, A. , F. Disegni, P. Mattavelli, E. Gomiero, G. Samanni, C. Jahan, R. Berthelon, O. Weber, E. Richard, V. Barral, A. Villaret, S. Kohler, J. Grenier, R. Ranica, C. Gallon, A. Souhaite, D. Ristoiu, L. Favennec, V. Caubet, S. Delmedico, N. Cherault, R. Beneyton, S. Chouteau, P. Sassoulas, A. Vernhet, Y. Le Friec, F. Domengie, et al., 2018 IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, USA 2018, pp. 18.4.1–18.4.4.
- 29M. Boniardi, M. Baldo, M. Allegra, A. Redaelli, Adv. Electron. Mater. 2024, 10, 2400599.
- 30S. Ovshinsky, US Patent 3271591, 1966.
- 31K. Büer, J. Non-Cryst. Solids 1970, 2, 444.
10.1016/0022-3093(70)90159-6 Google Scholar
- 32S. R. Ovshinsky, Phys. Rev. Lett. 1968, 21, 1450.
- 33D. Adler, M. S. Shur, M. Silver, S. R. Ovshinsky, J. Appl. Phys. 1980, 51, 3289.
- 34A. Pirovano, A. Lacaita, A. Benvenuti, F. Pellizzer, R. Bez, IEEE Trans. Electron Devices 2004, 51, 452.
- 35D. Ielmini, Y. Zhang, J. Appl. Phys. 2007, 102, 054517.
- 36A. Redaelli, A. Pirovano, A. Benvenuti, A. L. Lacaita, J. Appl. Phys. 2008, 103, 111101.
- 37N. F. Mott, Philos. Mag. 1969, 19, 835.
- 38A. Owen, J. Robertson, IEEE Trans. Electron Devices 1973, 20, 105.
- 39R. M. Hill, Philos. Mag. 1971, 24, 1307.
- 40H. Fritzsche, S. Ovshinsky, J. Non-Cryst. Solids 1970, 2, 393.
- 41H. Fritzsche, IBM J. Res. Dev. 1969, 13, 515.
- 42S. Ovshinsky, H. Fritzsche, IEEE Trans. Electron Devices 1973, 20, 91.
- 43M. Lankhorst, J. Non-Cryst. Solids 2002, 297, 210.
- 44L. Crespi, A. Ghetti, M. Boniardi, A. L. Lacaita, IEEE Electron Device Lett. 2014, 35, 747.
- 45N. Yamada, E. Ohno, N. Akahira, K. Nishiuchi, K. Nagata, M. Takao, Jpn. J. Appl. Phys. 1987, 26, 61.
- 46T. Matsunaga, N. Yamada, Phys. Rev. B 2004, 69, 104111.
- 47M. Wuttig, N. Yamada, Nat. Mater. 2007, 6, 824.
- 48S. Raoux, W. Weßnic, D. Ielmini, Chem. Rev. 2010, 110, 240.
- 49R. O. Jones, Solid State Sci. 2024, 152, 107524.
- 50T. Matsunaga, J. Akola, S. Kohara, T. Honma, K. Kobayashi, E. Ikenaga, R. O. Jones, N. Yamada, M. Takata, R. Kojima, Nat. Mater. 2011, 10, 129.
- 51J. Akola, R. O. Jones, Phys. Rev. B 2007, 76, 235201.
- 52R. G. Neale, D. L. Nelson, G. E. Moore, Electronics 1970, 43, 56.
- 53A. Pirovano, A. Lacaita, A. Benvenuti, F. Pellizzer, S. Hudgens, R. Bez, in IEEE Int. Electron Devices Meeting 2003 , IEEE, Washington, DC 2003 pp. 29.6.1–29.6.4.
- 54S. Lai, in IEEE Int. Electron Devices Meeting 2003, Washington, DC, USA, pp. 10.1.1–10.1.4.
- 55A. L. Lacaita, A. Redaelli, Microelectron. Eng. 2013, 109, 351.
- 56S. Lai, T. Lowrey, in Int. Electron Devices Meeting. Technical Digest (Cat. No.01CH37224), Washington, DC, USA 2001, pp. 36.5.1–36.5.4.
- 57Y. Hwang, J. Hong, S. Lee, S. Ahn, G. Jeong, G. Koh, J. Oh, H. Kim, W. Jeong, S. Lee, J. Park, K. Ryoo, H. Horii, Y. Ha, J. Yi, W. Cho, Y. Kim, K. Lee, S. Joo, S. Park, U. Chung, H. Jeong, K. Kim, in 2003 Symp. VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407), Kyoto, Japan 2003, pp. 173–174.
- 58Y. Hwang, S. Lee, S. Ahn, S. Lee, K. Ryoo, H. Hong, H. Koo, F. Yeung, J. Oh, H. Kim, W. Jeong, J. Park, H. Horii, Y. Ha, J. Yi, G. Koh, G. Jeong, H. Jeong, K. Kim, in IEEE Int. Electron Devices Meeting 2003, Washington, DC, USA, pp. 37.1.1–37.1.4.
- 59F. Pellizzer, A. Pirovano, F. Ottogalli, M. Magistretti, M. Scaravaggi, P. Zuliani, M. Tosi, A. Benvenuti, P. Besana, S. Cadeo, T. Marangon, R. Morandi, R. Piva, A. Spandre, R. Zonca, A. Modelli, E. Varesi, T. Lowrey, A. Lacaita, G. Casagrande, P. Cappelletti, R. Bez, in Digest Technical Papers. 2004 Symp. VLSI Technology, 2004, Honolulu, HI, USA, pp. 18–19.
- 60A. Pirovano, F. Pellizzer, A. Redaelli, I. Tortorelli, E. Varesi, F. Ottogalli, M. Tosi, P. Besana, R. Cecchini, R. Piva, M. Magistretti, M. Scaravaggi, G. Mazzone, P. Petruzza, F. Bedeschi, T. Marangon, A. Modelli, D. Ielmini, A. Lacaita, R. Bez, in Proc. 35th European Solid-State Device Research Conf., 2005. ESSDERC 2005 , Grenoble, France, pp. 313–316.
- 61F. Bedeschi, C. Resta, O. Khouri, E. Buda, L. Costa, M. Ferraro, F. Pellizzer, F. Ottogalli, A. Pirovano, M. Tosi, R. Bez, R. Gastaldi, G. Casagrande, in 2004 Symp. VLSI Circuits. Digest of Technical Papers (IEEE Cat. No.04CH37525), Honolulu, HI, USA 2004, pp. 442–445.
- 62W. Y. Cho, B.-H. Cho, B.-G. Choi, H.-R. Oh, S. Kang, K.-S. Kim, K.-H. Kim, D.-E. Kim, C.-K. Kwak, H.-G. Byun, Y. Hwang, S. Ahn, G.-H. Koh, G. Jeong, H. Jeong, K. Kim, IEEE J. Solid-State Circuits 2005, 40, 293.
- 63F. Pellizzer, A. Benvenuti, B. Gleixner, Y. Kim, B. Johnson, M. Magistretti, T. Marangon, A. Pirovano, R. Bez, G. Atwood, in 2006 Symp. VLSI Technology 2006, Digest of Technical Papers 2006, Honolulu, HI, USA, pp. 122–123.
- 64A. Pirovano, F. Pellizzer, I. Tortorelli, R. Harrigan, M. Magistretti, P. Petruzza, E. Varesi, D. Erbetta, T. Marangon, F. Bedeschi, R. Fackenthal, G. Atwood, R. Bez, in ESSDERC 2007 - 37th European Solid State Device Research Conf., Munich, Germany 2007, pp. 222–225.
- 65J. Oh, J. Park, Y. Lim, H. Lim, Y. Oh, J. Kim, J. Shin, J. Park, Y. Song, K. Ryoo, D. Lim, S. Park, J. Kim, J. Kim, J. Yu, F. Yeung, C. Jeong, J. Kong, D. Kang, G. Koh, G. Jeong, H. Jeong, K. Kim, in 2006 Int. Electron Devices Meeting, San Francisco, CA, USA 2006, pp. 1–4.
- 66K.-J. Lee, B.-H. Cho, W.-Y. Cho, S. Kang, B.-G. Choi, H.-R. Oh, C.-S. Lee, H.-J. Kim, J.-M. Park, Q. Wang, M.-H. Park, Y.-H. Ro, J.-Y. Choi, K.-S. Kim, Y.-R. Kim, I.-C. Shin, K.-W. Lim, H.-K. Cho, C.-H. Choi, W.-R. Chung, D.-E. Kim, K.-S. Yu, G.-T. Jeong, H.-S. Jeong, C.-K. Kwak, C.-H. Kim, K. Kim, in 2007 IEEE Int. Solid-State Circuits Conf., Digest of Technical Papers, San Francisco, CA, USA 2007, pp. 472–616.
- 67T. Happ, M. Breitwisch, A. Schrott, J. Philipp, M. Lee, R. Cheek, T. Nirschl, M. Lamorey, C. Ho, S. Chen, C. Chen, E. Joseph, S. Zaidi, G. Burr, B. Yee, Y. Chen, S. Raoux, H. Lung, R. Bergmann, C. Lam, in 2006 Symp. VLSI Technology, 2006. Digest of Technical Papers , Honolulu, HI, USA, pp. 120–121.
- 68M. Breitwisch, T. Nirschl, C. Chen, Y. Zhu, M. Lee, M. Lamorey, G. Burr, E. Joseph, A. Schrott, J. Philipp, R. Cheek, T. Happ, S. Chen, S. Zaidi, P. Flaitz, J. Bruley, R. Dasaka, B. Rajendran, S. Rossnagel, M. Yang, Y. Chen, R. Bergmann, H. Lung, C. Lam, in 2007 IEEE Symp. VLSI Technology, Kyoto, Japan 2007, pp. 100–101.
- 69T. Nirschl, J. Philipp, T. Happ, G. Burr, B. Rajendran, M.-H. Lee, A. Schrott, M. Yang, M. Breitwisch, C.-F. Chen, E. Joseph, M. Lamorey, R. Cheek, S.-H. Chen, S. Zaidi, S. Raoux, Y. Chen, Y. Zhu, R. Bergmann, H.-L. Lung, C. Lam, in 2007 IEEE Int. Electron Devices Meeting, Washington, DC, USA 2007, pp. 461–464.
- 70G. Servalli, in 2009 IEEE Int. Electron Devices Meeting (IEDM) 2009, Baltimore, MD, USA, pp. 1–4.
- 71C. Villa, D. Mills, G. Barkley, H. Giduturi, S. Schippers, D. Vimercati, in 2010 IEEE Int. Solid-State Circuits Conf. - (ISSCC), San Francisco, CA, USA 2010, pp. 270–271.
- 72A. Redaelli, E. Petroni, R. Annunziata, Mater. Sci. Semicond. Process. 2022, 137, 106184.
- 73R. Annunziata, P. Zuliani, M. Borghi, G. De Sandre, L. Scotti, C. Prelini, M. Tosi, I. Tortorelli, F. Pellizzer, in 2009 IEEE Int. Electron Devices Meeting (IEDM), Baltimore, MD, USA 2009, pp. 1–4.
- 74D. Kau, S. Tang, I. V. Karpov, R. Dodge, B. Klehn, J. A. Kalb, J. Strand, A. Diaz, N. Leung, J. Wu, S. Lee, T. Langtry, K. Wei Chang, C. Papagianni, J. Lee, J. Hirst, S. Erra, E. Flores, N. Righos, H. Castro, G. Spadini, in 2009 IEEE Int. Electron Devices Meeting (IEDM) 2009, Baltimore, MD, USA, pp. 1–4.
- 75https://www.techinsights.com/blog/intel-3d-xpoint-memory-die-removed-intel-optanetm-pcm-phase-change-memory (accessed: April 2025).
- 76A. Fazio, in 2020 IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, USA 2020, pp. 24.1.1–24.1.4.
- 77F. Pellizzer, A. Pirovano, R. Bez, R. L. Meyer, in 2023 Int. Electron Devices Meeting (IEDM), San Francisco, CA, USA 2023, pp. 1–4.
- 78J. Yi, M. Kim, J. Seo, N. Park, S. Lee, J. Kim, G. Do, H. Jang, H. Koo, S. Cho, S. Chae, T. Kim, M.-H. Na, S. Cha, in 2023 IEEE Symp. VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan 2023, pp. 1–2.
- 79N. Papandreou, H. Pozidis, A. Pantazi, A. Sebastian, M. Breitwisch, C. Lam, E. Eleftheriou, in 2011 IEEE Int. Symp. Circuits and Systems (ISCAS), Rio de Janeiro, Brazil 2011, pp. 329–332.
- 80A. Athmanathan, M. Stanisavljevic, N. Papandreou, H. Pozidis, E. Eleftheriou, IEEE J. Emerging Sel. Top. Circuits Syst. 2016, 6, 87.
- 81S. Raoux, R. M. Shelby, J. Jordan-Sweet, B. Munoz, M. Salinga, Y.-C. Chen, Y.-H. Shih, E.-K. Lai, M.-H. Lee, Microelectron. Eng. 2008, 85, 2330.
- 82C.-F. Chen, A. Schrott, M. H. Lee, S. Raoux, Y. H. Shih, M. Breitwisch, F. H. Baumann, E. K. Lai, T. M. Shaw, P. Flaitz, R. Cheek, E. A. Joseph, S. H. Chen, B. Rajendran, H. L. Lung, C. Lam, in 2009 IEEE Int. Memory Workshop, Monterey, CA, USA 2009, pp. 1–2.
- 83R. Bez, in 2009 IEEE Int. Electron Devices Meeting (IEDM) 2009, Baltimore, MD, USA, pp. 1–4.
- 84M. Boniardi, A. Redaelli, I. Tortorelli, S. Lavizzari, A. Pirovano, F. Pellizzer, E. Varesi, D. Erbetta, C. Bresolin, A. Modelli, R. Bez, in 2012 4th IEEE Int. Memory Workshop, IEEE, Milan, Italy 2012, pp. 1–3, ISBN 978-1-4673-1081-9 978-1-4673-1079-6, http://ieeexplore.ieee.org/document/6213679/.
- 85H. Y. Cheng, J. Y. Wu, R. Cheek, S. Raoux, M. BrightSky, D. Garbin, S. Kim, T. H. Hsu, Y. Zhu, E. K. Lai, E. Joseph, A. Schrott, S. C. Lai, A. Ray, H. L. Lung, C. Lam, in 2012 Int. Electron Devices Meeting, San Francisco, CA, USA 2012, pp. 31.1.1–31.1.4.
- 86H. Y. Cheng, M. BrightSky, S. Raoux, C. F. Chen, P. Y. Du, J. Y. Wu, Y. Y. Lin, T. H. Hsu, Y. Zhu, S. Kim, C. M. Lin, A. Ray, H. L. Lung, C. Lam, in 2013 IEEE Int. Electron Devices Meeting, Washington, DC, USA 2013, pp. 30.6.1–30.6.4.
- 87G. Betti Beneventi, L. Perniola, V. Sousa, E. Gourvest, S. Maitrejean, J. Bastien, A. Bastard, B. Hyot, A. Fargeix, C. Jahan, J. Nodin, A. Persico, A. Fantini, D. Blachier, A. Toffoli, S. Loubriat, A. Roule, S. Lhostis, H. Feldis, G. Reimbold, T. Billon, B. De Salvo, L. Larcher, P. Pavan, D. Bensahel, P. Mazoyer, R. Annunziata, P. Zuliani, F. Boulanger, Solid-State Electron. 2011, 65–66, 197, .
- 88X. Zhou, M. Xia, F. Rao, L. Wu, X. Li, Z. Song, S. Feng, H. Sun, ACS Appl. Mater. Interfaces 2014, 6, 14207.
- 89H. Y. Cheng, W. C. Chien, M. BrightSky, Y. H. Ho, Y. Zhu, A. Ray, R. Bruce, W. Kim, C. W. Yeh, H. L. Lung, C. Lam, in 2015 IEEE Int. Electron Devices Meeting (IEDM), Washington, DC, USA 2015, pp. 3.5.1–3.5.4.
- 90X. Chen, Y. Zheng, M. Zhu, K. Ren, Y. Wang, T. Li, G. Liu, T. Guo, L. Wu, X. Liu, Y. Cheng, Z. Song, Sci. Rep. 2018, 8, 6839.
- 91Y. Zhou, L. Sun, G. M. Zewdie, R. Mazzarello, V. L. Deringer, E. Ma, W. Zhang, J. Mater. Chem. C 2020, 8, 3646.
- 92R. E. Simpson, P. Fons, A. V. Kolobov, T. Fukaya, M. Krbal, T. Yagi, J. Tominaga, Nat. Nanotechnol. 2011, 6, 501.
- 93R. Wang, V. Bragaglia, J. E. Boschker, R. Calarco, Cryst. Growth Des. 2016, 16, 3596.
- 94S. Cecchi, E. Zallo, J. Momand, R. Wang, B. J. Kooi, M. A. Verheijen, R. Calarco, APL Mater. 2017, 5, 026107.
- 95M. Boniardi, J. E. Boschker, J. Momand, B. J. Kooi, A. Redaelli, R. Calarco, Phys. Status Solidi RRL 2019, 13, 1800634.
- 96A. I. Khan, X. Wu, C. Perez, B. Won, K. Kim, P. Ramesh, H. Kwon, M. C. Tung, Z. Lee, I.-K. Oh, K. Saraswat, M. Asheghi, K. E. Goodson, H.-S. P. Wong, E. Pop, Nano Lett. 2022, 22, 6285.
- 97M. Salinga, B. Kersting, I. Ronneberger, V. P. Jonnalagadda, X. T. Vu, M. Le Gallo, I. Giannopoulos, O. Cojocaru-Mirédin, R. Mazzarello, A. Sebastian, Nat. Mater. 2018, 17, 681.
- 98G. W. Burr, M. J. Brightsky, A. Sebastian, H.-Y. Cheng, J.-Y. Wu, S. Kim, N. E. Sosa, N. Papandreou, H.-L. Lung, H. Pozidis, E. Eleftheriou, C. H. Lam, IEEE J. Emerging Sel. Top. Circuits Syst. 2016, 6, 146.
- 99P. Zuliani, E. Varesi, E. Palumbo, M. Borghi, I. Tortorelli, D. Erbetta, G. D. Libera, N. Pessina, A. Gandolfo, C. Prelini, L. Ravazzi, R. Annunziata, IEEE Trans. Electron Devices 2013, 60, 4020.
- 100P. Cappelletti, R. Annunziata, F. Arnaud, F. Disegni, A. Maurelli, P. Zuliani, J. Phys. D: Appl. Phys. 2020, 53, 193002.
- 101N. Ciocchini, E. Palumbo, M. Borghi, P. Zuliani, R. Annunziata, D. Ielmini, in 2013 IEEE Int. Electron Devices Meeting 2013, Washington, DC, USA, pp. 22.1.1–22.1.4.
- 102A. Redaelli, A. Gandolfo, G. Samanni, E. Gomiero, E. Petroni, L. Scotti, A. Lippiello, P. Mattavelli, J. Jasse, D. Codegoni, A. Serafini, R. Ranica, C. Boccaccio, J. Sandrini, R. Berthelon, J. Grenier, O. Weber, D. Turgis, A. Valery, S. Del Medico, V. Caubet, J. Reynard, D. Dutartre, L. Favennec, A. Conte, F. Disegni, M. De Tomasi, A. Ventre, M. Baldo, D. Ielmini, et al., in ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conf. (ESSDERC), Grenoble, France 2021, pp. 231–234.
- 103E. Petroni, A. Serafini, D. Codegoni, P. Targa, L. Mariani, M. Scuderi, G. Nicotra, A. Redaelli, Front. Phys. 2022, 10, 862954.
- 104E. Palumbo, P. Zuliani, M. Borghi, R. Annunziata, Solid-State Electron. 2017, 133, 38.
- 105M. Boniardi, D. Ielmini, Appl. Phys. Lett. 2011, 98, 243506.
- 106S. Gabardi, S. Caravati, G. C. Sosso, J. Behler, M. Bernasconi, Phys. Rev. B 2015, 92, 054201.
- 107L. Laurin, M. Baldo, E. Petroni, G. Samanni, L. Turconi, A. Motta, M. Borghi, A. Serafini, D. Codegoni, M. Scuderi, S. Ran, A. Claverie, D. Ielmini, R. Annunziata, A. Redaelli, in 2023 IEEE Int. Reliability Physics Symp. (IRPS), Monterey, CA, USA 2023, pp. 1–7.
- 108I. Boybat, T. Boesch, M. Allegra, M. Baldo, J. Bertolini-Agnoletto, G. W. Burr, A. Buschini, A. Cabrini, E. Calvetti, C. Cappetta, F. Conti, E. Ferro, E. F. Scarselli, A. Garofalo, F. Girardi, G. Islamoglu, V. P. Jonnalagadda, G. Karunaratne, C. Lammie, M. Le Gallo, C. Li, R. Massa, A. C. Ornstein, H. Pang, M. Pasotti, B. Rajendran, A. Redaelli, I. Sanli, W. A. Simon, A. Singh, S.-P. Singh, G. Urlini, A. Vasilopoulos, R. Zurla, G. Desoli, A. Sebastian, in 2024 IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, USA 2024, pp. 1–4.
- 109Y. LeCun, Y. Bengio, G. Hinton, Nature 2015, 521, 436.
- 110A. Redaelli, F. Pellizzer, A. Pirovano, Ger., European Patent 2034536 B1, 2012.
- 111W. W. Koelmans, A. Sebastian, V. P. Jonnalagadda, D. Krebs, L. Dellmann, E. Eleftheriou, Nat. Commun. 2015, 6, 8181.
- 112S. Ghazi Sarwat, T. M. Philip, C.-T. Chen, B. Kersting, R. L. Bruce, C.-W. Cheng, N. Li, N. Saulnier, M. BrightSky, A. Sebastian, Adv. Funct. Mater. 2021, 31, 2106547.
- 113K. Ding, J. Wang, Y. Zhou, H. Tian, L. Lu, R. Mazzarello, C. Jia, W. Zhang, F. Rao, E. Ma, Science 2019, 366, 210.
- 114R. Piombo, S. Ritarossi, R. Mazzarello, Adv. Sci. 2024, 11, 2402375.
- 115X. Wu, A. I. Khan, H. Lee, C.-F. Hsu, H. Zhang, H. Yu, N. Roy, A. V. Davydov, I. Takeuchi, X. Bao, H.-S. P. Wong, E. Pop, Nat. Commun. 2024, 15, 13.
- 116S.-O. Park, S. Hong, S.-J. Sung, D. Kim, S. Seo, H. Jeong, T. Park, W. J. Cho, J. Kim, S. Choi, Nature 2024, 628, 293.
- 117M. Boniardi, A. Redaelli, C. Cupeta, F. Pellizzer, L. Crespi, G. D’Arrigo, A. L. Lacaita, G. Servalli, in 2014 IEEE Int. Electron Devices Meeting, San Francisco, CA, USA 2014, pp. 29.1.1–29.1.4.
- 118B. J. Shastri, A. N. Tait, T. Ferreira de Lima, W. H. P. Pernice, H. Bhaskaran, C. D. Wright, P. R. Prucnal, Nat. Photonics 2021, 15, 102.
- 119Y. Shen, N. C. Harris, S. Skirlo, M. Prabhu, T. Baehr-Jones, M. Hochberg, X. Sun, S. Zhao, H. Larochelle, D. Englund, M. Soljačić, Nat. Photonics 2017, 11, 441.
- 120J. Feldmann, N. Youngblood, M. Karpov, H. Gehring, X. Li, M. Stappers, M. Le Gallo, X. Fu, A. Lukashchuk, A. S. Raja, J. Liu, C. D. Wright, A. Sebastian, T. J. Kippenberg, W. H. P. Pernice, H. Bhaskaran, Nature 2021, 589, 52.
- 121C. Rios, N. Youngblood, Z. Cheng, M. L. Gallo, W. H. P. Pernice, C. D. Wright, A. Sebastian, H. Bhaskaran, Sci. Adv. 2019, 5, eaau5759.
- 122I. Tortorelli, S. Tang, C. Papagianni, US Patent 10134470, 2018.
- 123M. Kim, Y. Bae, J. Park, J. Yeon, H. Shim, S. Jin, H. Kim, S. Oh, G. Do, D. Yun, H. D. Lee, D. Ahn, J. Lee, M. Park, J. Yoon, J. Yi, T. Kim, G. Park, S. Chung, J. Cheon, S. Chae, N. Park, K. Kim, D. Oh, J. Yi, S. Cha, in 2024 IEEE Symp. VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA 2024, pp. 1–2.
- 124J. Lee, Y. Seo, S. Ban, D. G. Kim, Y. B. Park, T. H. Lee, H. Hwang, IEEE Trans. Electron Devices 2024, 71, 3351.
- 125W. Chien, J. Zheng, C. Yeh, L. Gignac, H. Cheng, Z. Liu, A. Grun, C. Sung, E. Lai, S. Cheng, C. Cheng, L. Buzi, A. Ray, D. Bishop, R. Bruce, M. BrightSky, H. Lung, in 2024 IEEE Symp. VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA 2024, pp. 1–2.
- 126T. Ravsher, R. Degraeve, D. Garbin, S. Clima, A. Fantini, G. Donadio, S. Kundu, W. Devulder, H. Hody, G. Potoms, J. Van Houdt, V. Afanas'ev, A. Belmonte, G. Kar, in 2024 IEEE Int. Reliability Physics Symp. (IRPS), Grapevine, TX, USA 2024, pp. 7A.5–1–7A.5–9.
- 127P. Fantini, A. Ghetti, E. Varesi, A. Pirovano, D. Baratella, C. Ribaldone, D. Campi, M. Bernasconi, R. Bez, in 2024 IEEE Int. Electron Devices Meeting (IEDM), San Francisco, CA, USA 2024, pp. 1–4.
- 128M. Kinoshita, Y. Sasago, H. Minemura, Y. Anzai, M. Tai, Y. Fujisaki, S. Kusaba, T. Morimoto, T. Takahama, T. Mine, A. Shima, Y. Yonamoto, T. Kobayashi, in 2012 Symp. VLSI Technology (VLSIT), Honolulu, HI, USA 2012, pp. 35–36.
- 129N. Hur, Y. Kim, B. Park, S. Yoon, S. Kim, D.-H. Lim, H. Jeong, Y. Kwon, J. Suh, Small Methods 2024, 9, 2401381.
- 130A. I. Khan, A. Daus, R. Islam, K. M. Neilson, H. R. Lee, H. P. Wong, E. Pop, Science 2021, 373, 1243.
- 131A. I. Khan, A. Daus, E. Pop, in 2020 Device Research Conf. (DRC) 2020, Columbus, OH, USA, p. 1.
- 132S. Calvi, M. Bertelli, S. De Simone, F. Maita, S. Prili, A. Diaz Fattorini, F. De Matteis, V. Mussi, F. Righi Riva, M. Longo, F. Arciprete, R. Calarco, Adv. Electron. Mater. 2024, 11, 2400184.
- 133F. M. Schenk, T. Zellweger, D. Kumaar, D. Bošković, S. Wintersteller, P. Solokha, S. De Negri, A. Emboras, V. Wood, M. Yarema, ACS Nano 2024, 18, 1063.
- 134H. He, D. Kumaar, K. Portner, T. Zellweger, F. M. Schenk, S. Wintersteller, V. Vlnieska, A. Emboras, V. Wood, M. Yarema, Adv. Electron. Mater. 2024, 10, 2400203.