Volume 53, Issue 11 pp. 2569-2572

A novel design of organic semiconductor thin film device embedded microstrip antenna

Hsien Chiao Teng

Corresponding Author

Hsien Chiao Teng

Department of Electronic Engineering, I-Shou University, No. 1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung 84008, Taiwan, Republic of China

Department of Electronic Engineering, I-Shou University, No. 1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung 84008, Taiwan, Republic of ChinaSearch for more papers by this author
Shen Cherng

Shen Cherng

Department of Computer Science and Information Engineering, Cherngshiu University, 840, Chengcing Rd., Niaosong Township, Kaohsiung 83347, Taiwan, Republic of China

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Yu-Jung Huang

Yu-Jung Huang

Department of Electronic Engineering, I-Shou University, No. 1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung 84008, Taiwan, Republic of China

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First published: 19 August 2011

Abstract

Implanting an organic semiconductor thin film (OSTF) device into an inexpensive FR4 substrate to design a microstrip antenna is demonstrated in this article. When the substrate was grounded for the device, special features of the frequency dependent I–V curves and the PN junction built-in potential formed by joining of C60 (n-type) and CuPC (p-type) OSTFs can be obtained. The device can thus be activated and excited as a microstrip antenna by the side probe-fed simultaneously. Meanwhile, the antenna gains can be modified by changing the thin film thickness as well as the source voltage of probe-fed to excite the resonated mode of the structure of the microstrip antenna. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:2569–2572, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.26338

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