Volume 108, Issue 4 pp. 2321-2327

Curing behavior and properties of the cured resin based on bismaleimide, bisoxazoline, and oleic acid ternary copolymer

Youqing Li

Youqing Li

Department of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, People's Republic of China

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Shengfang Li

Shengfang Li

School of Chemical and Material Engineering, Huangshi Institute of Technology, Huangshi 435003, People's Republic of China

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Heqing Tang

Corresponding Author

Heqing Tang

Department of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, People's Republic of China

Department of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, People's Republic of China===Search for more papers by this author
First published: 12 February 2008
Citations: 7

Abstract

The curing behavior and properties of bismaleimide (BMI), bisoxazoline (1,3-PBO), and oleic acid ternary copolymers are investigated. It is found that the cure temperature of BMI/1,3-PBO or BMI/1,3-PBO/oleic acid could be lowered, compared with that of BMI. The reason lies in the copolymerization reaction between BMI, 1,3-PBO, and oleic acid. SEM results confirm that 1,3-PBO and oleic acid could toughen BMI system because of the formation of ester–amide bonds and the long fat chain of oleic acid. The cured resins from BMI/1,3-PBO or BMI/1,3-PBO/oleic acid have superior heat resistance and water resistance. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci 2008

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