Advanced Packaging of Optoelectronic Devices
Zirong Tang,
Tielin Shi,
Frank G. Shi,
Zirong Tang
Wuhan National Laboratory for Optoelectronics
School of Mechanical Science and Engineering, Huazhong University of Science and Technology
Search for more papers by this authorTielin Shi
Wuhan National Laboratory for Optoelectronics
School of Mechanical Science and Engineering, Huazhong University of Science and Technology
Search for more papers by this authorFrank G. Shi
Optoelectronics Packaging & Materials Labs, University of California
Search for more papers by this authorZirong Tang,
Tielin Shi,
Frank G. Shi,
Zirong Tang
Wuhan National Laboratory for Optoelectronics
School of Mechanical Science and Engineering, Huazhong University of Science and Technology
Search for more papers by this authorTielin Shi
Wuhan National Laboratory for Optoelectronics
School of Mechanical Science and Engineering, Huazhong University of Science and Technology
Search for more papers by this authorFrank G. Shi
Optoelectronics Packaging & Materials Labs, University of California
Search for more papers by this authorAbstract
In recent years, the packaging technologies of advanced optoelectronics devices and systems have evolved rapidly to meet the fast-growing industry of optoelectronics. However, packaging expense still accounts for a major portion of the overall cost of optoelectronics devices and systems. With the driving trend of higher power, smaller size, and higher reliability, many advanced packaging technologies are emerging. In this article, we present a comprehensive introduction of packaging design rules, advanced packaging materials, and packaging processes. Specific examples with state-of-art packaging methodologies are given for some typical devices, including high-power, light-emitting diodes; high-power semiconductor lasers; liquid crystal displays; and fiber-related optical devices. Insights on the technological development trend and philosophy are also discussed for advanced packaging of optoelectronic devices.
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