Volume 206, Issue 8 pp. 869-877
Full Paper

Study on the Gelation of a No-Flow Underfill Through Monte Carlo Simulation

Zhuqing Zhang

Zhuqing Zhang

School of Materials Science and Engineering Georgia Institute of Technology 771 Ferst Drive, Atlanta, GA 30332, USA

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Tsuyoshi Yamashita

Tsuyoshi Yamashita

School of Materials Science and Engineering Georgia Institute of Technology 771 Ferst Drive, Atlanta, GA 30332, USA

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Ching P. Wong

Corresponding Author

Ching P. Wong

School of Materials Science and Engineering Georgia Institute of Technology 771 Ferst Drive, Atlanta, GA 30332, USA

School of Materials Science and Engineering Georgia Institute of Technology 771 Ferst Drive, Atlanta, GA 30332, USA. Fax: 404-894-9140Search for more papers by this author
First published: 19 April 2005
Citations: 9

Abstract

Summary: The gelation behavior of an epoxy/anhydride system was studied using the differential scanning calorimeter (DSC) and a stress rheometer. It was found that the gelation was dependent on the curing temperature. At a higher curing temperature, the resin tended to gel at lower degree of cure (DOC). Monte Carlo (MC) simulation was performed, to investigate the effect of curing kinetics on the network formation and the gelation. Both the effects of the propagation rate and the catalyst concentration was studied. The temperature dependent gelation was related to the change of propagation/initiation ratio with temperature according to the simulation results.

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Reaction mechanism of the epoxy/anhydride curing.

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