Volume 9, Issue 5 pp. 235-238
Communication

Growth of Praseodymium Oxide Thin Films by Liquid Injection MOCVD Using a Novel Praseodymium Alkoxide Precursor

H.C. Aspinall

H.C. Aspinall

Department of Chemistry, University of Liverpool, Liverpool, L69 3ZD, UK

Search for more papers by this author
J. Gaskell

J. Gaskell

Department of Chemistry, University of Liverpool, Liverpool, L69 3ZD, UK

Search for more papers by this author
P.A. Williams

P.A. Williams

Epichem Oxides and Nitrides, Power Road, Bromborough, Wirral, Merseyside, CH62 3QF, UK

Search for more papers by this author
A.C. JonesP.R. Chalker

P.R. Chalker

Department of Materials Science and Engineering, University of Liverpool, Liverpool, L69 3BX, UK

Search for more papers by this author
P.A. Marshall

P.A. Marshall

Department of Materials Science and Engineering, University of Liverpool, Liverpool, L69 3BX, UK

Search for more papers by this author
J.F. Bickley

J.F. Bickley

Department of Chemistry, University of Liverpool, Liverpool, L69 3ZD, UK

Search for more papers by this author
L.M. Smith

L.M. Smith

Epichem Oxides and Nitrides, Power Road, Bromborough, Wirral, Merseyside, CH62 3QF, UK

Search for more papers by this author
G.W. Critchlow

G.W. Critchlow

Institute of Surface Science and Technology, University of Loughborough, Loughborough, Leicestershire LE11 3TU, UK

Search for more papers by this author
First published: 23 October 2003
Citations: 34

We are grateful to Epichem Limited for support of this work.

Abstract

Praseodymium oxide thin films are prepared using a new volatile precursor (for structure of precursor LiCl complex, see Figure) by liquid injection MOCVD. The oxide, a wide-bandgap (3.9 eV) and high-κ material, which is currently being investigated as a possible alternative to SiO2 films in silicon-based field-effect transistors, is deposited from [Pr(mmp)3] (mmp = OCMe2CH2OMe) in the presence of oxygen over the temperature range 350–600 °C.

The full text of this article hosted at iucr.org is unavailable due to technical difficulties.