Research Article
Pool Boiling Heat Transfer on a Micro-Structured Copper Oxide Surface with Varying Wettability
Pulak Sen,
Sanjib Kalita,
Dipak Sen,
Sudev Das,
Ajoy Kumar Das,
Pulak Sen
National Institute of Technology Agartala, Department of Mechanical Engineering, Jirania, 799046 Tripura, India
Search for more papers by this authorSanjib Kalita
National Institute of Technology Arunachal Pradesh, Department of Mechanical Engineering, Jote, 791113 Arunachal Pradesh, India
Search for more papers by this authorCorresponding Author
Dipak Sen
National Institute of Technology Arunachal Pradesh, Department of Mechanical Engineering, Jote, 791113 Arunachal Pradesh, India
Correspondence: Dipak Sen ([email protected]), National Institute of Technology Arunachal Pradesh, Department of Mechanical Engineering, Jote, Arunachal Pradesh, 791113, India.Search for more papers by this authorSudev Das
National Institute of Technology Calicut, Department of Chemical Engineering, Kozhikode, 673601 Kerala, India
Search for more papers by this authorAjoy Kumar Das
National Institute of Technology Agartala, Department of Mechanical Engineering, Jirania, 799046 Tripura, India
Search for more papers by this authorPulak Sen,
Sanjib Kalita,
Dipak Sen,
Sudev Das,
Ajoy Kumar Das,
Pulak Sen
National Institute of Technology Agartala, Department of Mechanical Engineering, Jirania, 799046 Tripura, India
Search for more papers by this authorSanjib Kalita
National Institute of Technology Arunachal Pradesh, Department of Mechanical Engineering, Jote, 791113 Arunachal Pradesh, India
Search for more papers by this authorCorresponding Author
Dipak Sen
National Institute of Technology Arunachal Pradesh, Department of Mechanical Engineering, Jote, 791113 Arunachal Pradesh, India
Correspondence: Dipak Sen ([email protected]), National Institute of Technology Arunachal Pradesh, Department of Mechanical Engineering, Jote, Arunachal Pradesh, 791113, India.Search for more papers by this authorSudev Das
National Institute of Technology Calicut, Department of Chemical Engineering, Kozhikode, 673601 Kerala, India
Search for more papers by this authorAjoy Kumar Das
National Institute of Technology Agartala, Department of Mechanical Engineering, Jirania, 799046 Tripura, India
Search for more papers by this authorAbstract
Copper surface is modified to copper oxide surface for high heat flux electronics applications. Copper oxide surface is prepared by chemical etching using NaOH and (NH4)2S2O8. A pool boiling experiment is conducted to investigate the critical heat flux (CHF) and boiling heat transfer coefficient (BHTC). The results indicate that BHTC of all copper oxide surfaces are enhanced remarkably. Bubble dynamics are also analyzed by means of a high-speed camera. Bubble visualization demonstrates that the active nucleation sites for the copper oxide surfaces are higher than the bare copper surface.
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