Ethylene–propylene–diene terpolymer/silica compound modification with organosilane [bis(triethoxysilylpropyl)disulfide] and improved processability and mechanical properties
Kwang-Jea Kim,
Corresponding Author
Kwang-Jea Kim
Institute of Polymer Engineering, The University of Akron, Ohio 44325-0301
Institute of Polymer Engineering, The University of Akron, Ohio 44325-0301===Search for more papers by this authorKwang-Jea Kim,
Corresponding Author
Kwang-Jea Kim
Institute of Polymer Engineering, The University of Akron, Ohio 44325-0301
Institute of Polymer Engineering, The University of Akron, Ohio 44325-0301===Search for more papers by this authorAbstract
Bifunctional silane [bis(triethoxysilylpropyl)disulfide (TESPD)] was added to a silica-containing ethylene–propylene–diene terpolymer mold compound, and its effects with respect to the vulcanization properties, processability, and physical properties were investigated. The addition of TESPD caused reduced heat generation during mixing, low minimum torque, low drop temperature, and low extrusion pressure buildup in the extruder. It also caused a high vulcanization torque, high torque rise, high torque maximum, and high elongational modulus. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010
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