Settling of Inclusions in Top‐cut Solar Grade Silicon SOG‐Si Scraps under Electromagnetic Field - 3rd International Symposium on High‐Temperature Metallurgical Processing - Wiley Online Library

Settling of Inclusions in Top-cut Solar Grade Silicon SOG-Si Scraps under Electromagnetic Field

Lucas Nana Wiredu Damoah

Department of Materials Science & Engineering, Missouri University of Science and Technology (Missouri S&T), 223 McNutt Hall, Rolla, MO 65409-0340, USA

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Lifeng Zhang,

Lifeng Zhang

Department of Materials Science & Engineering, Missouri University of Science and Technology (Missouri S&T), 223 McNutt Hall, Rolla, MO 65409-0340, USA

School of Metallurgical and Ecological Engineering, University of Science & Technology Beijing, Beijing 100083, China

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Lucas Nana Wiredu Damoah,

Lucas Nana Wiredu Damoah

Department of Materials Science & Engineering, Missouri University of Science and Technology (Missouri S&T), 223 McNutt Hall, Rolla, MO 65409-0340, USA

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Lifeng Zhang,

Lifeng Zhang

Department of Materials Science & Engineering, Missouri University of Science and Technology (Missouri S&T), 223 McNutt Hall, Rolla, MO 65409-0340, USA

School of Metallurgical and Ecological Engineering, University of Science & Technology Beijing, Beijing 100083, China

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Book Editor(s):Tao Jiang,

Tao Jiang

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Jiann-Yang Hwang,

Jiann-Yang Hwang

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Patrick Masset,

Patrick Masset

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Onuralp Yucel,

Onuralp Yucel

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Rafael Padilla,

Rafael Padilla

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Guifeng Zhou,

Guifeng Zhou

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First published: 17 March 2012

https://doi.org/10.1002/9781118364987.ch34

Citations: 2

Summary

This chapter contains sections titled:

Introduction
Experimental Procedures
Results and Discussion
Summary

References

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Citing Literature

3rd International Symposium on High‐Temperature Metallurgical Processing