Die Attach Materials
Daniel Lu, Yangyang Sun, C. P. Wong,
C. P. Wong
Georgia Institute of Technolgy, Atlanta, GA
The Chinese University of Hong Kong
Search for more papers by this authorDaniel Lu, Yangyang Sun, C. P. Wong,
C. P. Wong
Georgia Institute of Technolgy, Atlanta, GA
The Chinese University of Hong Kong
Search for more papers by this authorFirst published: 19 September 2013
Abstract
Die attach materials such as solder, polymeric adhesive pastes and films, and gold alloys are used to bond the chip (die) and the substrate. This article overviews the practical processing requirements of die attach materials and their application to semiconductor packaging, including die attach film for advanced BGA/CSP, Pb-free packaging, and high-power applications. In addition, dual-function die attach films and future trends are also discussed.
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