Inspection in Semiconductor Manufacturing
Vijay Sankaran, Charles M. Weber, Fred Lakhani, Kenneth W. Tobin, Jr.,
Kenneth W. Tobin, Jr.
Oak Ridge National Laboratory, Oak Ridge, TN
Search for more papers by this authorVijay Sankaran, Charles M. Weber, Fred Lakhani, Kenneth W. Tobin, Jr.,
Kenneth W. Tobin, Jr.
Oak Ridge National Laboratory, Oak Ridge, TN
Search for more papers by this authorAbstract
The sections in this article are
- 1 Defect Reduction Cycle in Semiconductor Manufacturing
- 2 Inspection in the IC Manufacturing Process Life Cycle
- 3 Optical Imaging Technology
- 4 Laser-Scattering Technology
- 5 Measurement of Optical Scatter from Contaminants on Wafers
- 6 Automatic Defect Classification
- 7 Future Challenges
- 8 Conclusions
- 9 Acknowledgments
Bibliography
- 1 K. J. Arrow The economic implications of learning by doing, Rev. Econ. Studies, 29: 155–173, 1962.
- 2
T. P. Wright
Factors affecting the cost of airplanes,
J. Aeronaut. Sci.,
3:
122–128,
1936.
10.2514/8.155 Google Scholar
- 3 J. M. Juran, ed. Quality Control Handbook, 3rd ed., New York: McGraw-Hill, 1974.
- 4 C. Stapper R. Rosner Integrated circuit yield management and yield analysis: Development and implementation, IEEE Trans. Semicond. Manuf., 8: 95–101, 1995.
- 5 C. Weber B. Moslehi M. Dutta An integrated framework for yield management and defect/fault reduction, IEEE Trans. Semicond. Manuf., 8: 110–120, 1995.
- 6 C. Weber Accelerating three-dimensional experience curves in integrated circuit process development, Management of Technology master’s thesis, Massachusetts Institute Technology, 1996.
- 7 S. H. Thomke Managing experimentation in the design of new products, Harvard Business School Working Paper 96-037. Management Science, in press.
- 8 D. Jensen C. Gross D. Mehta New industry document explores defect reduction technology challenges, Micro 16 (1): 35–44, 1998.
- 9 D. L. Dance D. Jensen R. Collica Developing yield modeling and defect budgeting for 0.25 um and beyond, Micro 16 (3): 51–61, 1998.
- 10 P. Cielo Optical Techniques for Industrial Inspection, New York: Academic Press, 1988.
- 11 B. G. Batchelor D. A. Hill D. C. Hodgson Automated Visual Inspection, Amsterdam, The Netherlands: North-Holland, 1985.
- 12
L. F. Pau
Computer Vision for Electronics Manufacturing,
New York:
Plenum,
1990.
10.1007/978-1-4613-0507-1 Google Scholar
- 13 J. E. Thompson Inspection Organization and Methods, New York: McGraw-Hill, 1950.
- 14 E. S. Roth R. R. Runck Functional Inspection Techniques, Dearborn, MI: American Soc. of Tool Manuf. Engineers, 1967.
- 15 C. W. Kennedy D. E. Andrews Inspection and Gaging, 4th ed., New York: Industrial Press, 1967.
- 16 R. T. Chin C. A. Harlow Automated visual inspection: A survey, IEEE Trans. Pattern Anal. Mach. Intell., 4: 557–573, 1982.
- 17 R. T. Chin Automated visual inspection: 1981 to 1987, Comput. Vis., Graph. Image Process., 41: 346–381, 1988.
- 18 E. Bayro-Corrochano Review of automated visual inspection 1983 to 1993, Part I: Conventional approaches, Proc. SPIE, 2055, Intell. Robots Comput. Vision XII, 1993, pp. 128–158.
- 19 E. Bayro-Corrochano Review of automated visual inspection 1983 to 1993, Part II: Approaches to intelligent systems, Proc. SPIE, 2055, Intell. Robots Comput. Vision XII, 1993, pp. 159–172.
- 20 E. von Hippel “Sticky information” and the locus of problem solving: Implications for innovation, Manag. Sci., 40: 429–439.
- 21 D. Reinertsen Who dunit? The search for new-product killers, Electron. Bus. (July): 62–66, 1983.
- 22 P. Smith D. Reinertsen Developing Products in Half the Time,New York: Van Nostrand Reinhold, 1991.
- 23 S. Weelwright K. Clark Revolutionizing Product Development, New York: Free Press, 1992.
- 24 G. Moore Progress in digital integrated circuits, IEDM Tech. Dig., 1975, p. 11.
- 25 C. Dennison Developing effective inspection systems and strategies for monitoring CMP processes, Micro (February): 31–41, 1998.
- 26 Semiconductor Industry Association, The National Technology Roadmap for Semiconductors, 1997, pp. 163–178.
- 27 Semiconductor Industry Association, The National Technology Roadmap for Semiconductors, 1997, pp. 99–113.
- 28 C. Weber D. Jensen E. D. Hirleman What drives defect detection technology? Micro (June): 51–72, 1998.
- 29 U. Kaempf Statistical significance of defect density estimates, Proc. IEEE/ICMTS, 1988, pp. 107–113.
- 30 W. Tang Circuit integation pushes image sensor performance, Laser Focus World, 33 (2): 129–139, 1997.
- 31 S. Kempainen CMOS Image Sensors: Eclipsing CCDs in visual information? EDN, 42 (21): 105–119, 1997.
- 32 E. Fossum Image capture circuits in CMOS, Int. Symp. VLSI Technol. Syst. Appl., 1997.
- 33 CCD Image Sensors Databook, DALSA, Ontario, Canada, 1996.
- 34 T. S. Newman A. K. Jain A survey of automated visual inspection, Comput. Vis. Image Understand., 61 (2): 231–262, 1995.
- 35 S. G. Chamberlain High speed, low noise, fine resolution, TDI CCD imagers, SPIE CCDs Solid State Opt. Sensors, 1990.
- 36 The National Technology Roadmap for Semiconductors: Technology Needs, San Jose, CA: Semiconductor Industry Association, 1997, p. 163.
- 37
L. Reimer
Image Formation in Low-Voltage Scanning Electron Microscopy,
vol. 12, Bellingham, WA:
SPIE Optical Engineering Press,
1993.
10.1117/3.2265074 Google Scholar
- 38 E. I. Cole Jr. J. M. Soden Scanning electron microscopy techniques for IC failure analysis, Microelectronic Failure Analysis, 3rd ed., Materials Park, OH: ASM International, p. 163.
- 39 R. C. Gonzalez P. Wintz Digital Image Processing, 2nd ed., Reading, MA: Addison-Wesley, 1987, p. 94.
- 40 J. D. Gaskill Linear Systems, Fourier Transforms, and Optics, New York: Wiley, 1978, p. 269.
- 41 Lord Rayliegh Proc. Royal Soc., A79: 399, 1907.
- 42 C. E. Bohren D. R. Huffman Absorption and Scattering of Light by Small Particles, New York: Wiley, 1983.
- 43 T. A. Germer C. C. Asmail Bidirectional ellipsometry and its application to the characterization of surfaces, Proc. SPIE, 3121: 1997, pp. 173–182.
- 44 T. A. Germer Angular dependence and polarization of out-of-plane optical scattering from particulate contamination, subsurface defects, and surface microroughness, Appl. Opt., 36 (33): 8798–8805, 1997.
- 45 A. J. Hunt D. R. Huffman A new polarization-modulated light scattering instrument, Rev. Sci. Instrum., 44 (12): 1753, 1973.
- 46
J. C. Stover
Optical Scattering: Measurement and Analysis,
2nd ed., Washington:
SPIE Press,
1995.
10.1117/3.203079 Google Scholar
- 47 C. T. Larson Measuring haze on deposited metals with light-scattering-based inspection systems, Micro 14 (8): 31–38, 1996.
- 48 J. A. Bender T. D. Henning M. L. Bernt Near specular measurements of integrated scatter, Proc. SPIE, 1753: 1992, pp. 121–126.
- 49 R. S. Howland K. B. Wells B. M. Trafas High-speed detection of pattern defects using laser scattering, Solid State Technol., 38 (11): 123–126, 1995.
- 50 B. M. Trafas et al. Extendibility of laser scanning tools for advanced wafer inspection, Proc. SPIE, 2439: 1995, pp. 164–173.
- 51 K. A. Klicker et al. Practical reduction of instrument signature in near specular light scatter measurements, Proc. SPIE, 818: 1987, pp. 26–33.
- 52 R. S. Howland et al. Using calibration curve modeling for scanning surface inspection systems, Micro 13 (7): 61–71, 1995.
- 53 K. W. Tobin et al. Automated analysis for rapid defect sourcing and yield learning, Future Fab Int., 1: London: Technology Publishing, 1997, p. 313.
- 54 K. W. Tobin S. W. Allison J. K. Jordan Automated pattern recognition: Video weld authentication system, Applications of Digital Image Procesing XII, Proc. SPIE, 1153: 1989, p. 412.
- 55 J. C. Russ The Image Processing Handbook, Boca Raton, FL: CRC Press, 1992, p. 219.
- 56 S. S. Gleason M. A. Hunt W. B. Jatko Subpixel measurement of image features based on paraboloid surface fit, Proc. SPIE, 1386: 1990.
- 57 A. K. Jain Fundamentals of Digital Image Processing, Englewood Cliffs, NJ: Prentice-Hall, 1989, p. 377.
- 58 W. B. Jatko M. A. Hunt K. W. Tobin Nonlinear filter derived from topological image features, SPIE Aerospace Conf., Orlando, FL: 1990.
- 59 K. W. Tobin et al. An image paradigm for semiconductor defect data reduction, SPIE’s 21st Annu. Int. Symp. Microlithography, Santa Clara, CA, 1996.
- 60 K. W. Tobin et al. Automatic classification of spatial signatures on semiconductor wafermaps, SPIE 22nd Annu. Int. Symp. Microlithography, Santa Clara, CA, 1997.
- 61 S. S. Gleason K. W. Tobin T. P. Karnowski An integrated spatial signature Analysis and automtic defect classification system, 191st Meet. Electrochem. Soc., 1997.
- 62 M. O. Freeman B. E. A. Saleh Moment invariants in the space and frequency domains, J. Opt. Soc. Amer. A, 5 (7): 1073, 1988.
- 63 L. Prasad S. S. Iyengar Wavelet Analysis with Applications to Image Processing, Boca Raton, FL: CRC Press, 1997.
- 64 C. Teh R. T. Chin On image analysis by methods of moments, IEEE Trans. Pattern Anal. Mach. Intell., 10 (4): 496, 1988.
- 65 S. X. Lio M. Pawlak On image analysis by moments, IEEE Trans. Pattern Anal. Mach. Intell., 18 (3): 252, 1996.
- 66 J. T. Tou R. C. Gonzalez Pattern Recognition Principles, Reading, MA: Addison-Wesley, 1974.
- 67 R. O. Duda P. E. Hart Pattern Recognition and Scene Analysis, New York: Wiley, 1973.
- 68 C. H. Chen L. F. Pau P. S. P. Wang Handbook of Pattern Recognition and Computer Vision, River Edge, NJ: World Scientific, 1993, p. 16.
- 69 J. M. Bernardo A. F. M. Smith Bayesian Theory, New York: Wiley, 1994.
- 70 S. Haykin Neural Networks: A Comprehensive Foundation, New York: Macmillan, 1994.
- 71
K. Fukunaga
Introduction to Statistical Pattern Recognition,
2nd ed., New York:
Academic Press,
1990.
10.1016/B978-0-08-047865-4.50011-9 Google Scholar
- 72 Y. Yuan M. J. Shaw Induction of fuzzy decision trees, Artificial Intell. Tech. Rep., UIUC-BI-AI-DSS-94-02, Univ. Illinois, Urbana-Champaign, 1994.
- 73 J. M. Keller M. R. Gray J. A. Givens A fuzzy k-nearest neighbor algorithm, IEEE Trans. Syst., Man, Cybern., 15 (4): 580, 1985.
- 74 K. W. Tobin S. S. Gleason T. P. Karnowski Adaptation of the fuzzy k-nearest neighbor classifier for manufacturing automation, SPIE’s 10th Int. Symp. Electron. Imaging: Sci. Technol., San Jose, CA, 1998.
- 75 A. Shapiro T. James B. Trafas Advanced inspection for 0.25-μm-generation semiconductor manufacturing, SPIE’s 22nd Annu. Int. Symp. Microlithography, Santa Clara, CA, 1997, pp. 445–451.
- 76 M. Seliger M. B. Nasr Inspecting wafers using the Orbot-W720 at metal ASI, Process Diagnostic and Control User Group Meet., Santa Clara, CA, 1998.
- 77 P. Silverman Capital productivity: Major challenge for the semiconductor industry, Solid State Technol., 37 (3): 104, 1994.
- 78 M. Iansiti J. West Technology integration, Harvard Bus. Rev. May–June: 69–79, 1997.
- 79 C. Weber J. Rosner P. Chang The role of self-directed work teams in a concurrent, multi-generation process development effort, Proc. IEEE/SEMI/ASMC, Cambridge, MA: 1997, pp. 322–327.
- 80 R. Henderson K. Clark Architectural innovation: The reconfiguration of existing product technologies and the failure of established irms, Admin. Sci. Quart., 35: 9–30.
- 81 E. von Hippel The Sources of Innovation, Oxford, UK: Oxford University Press, 1988.
- 82 E. Wang et al. Valuation of yield management investments, Proc. IEEE/SEMI/ASMC, Cambridge, MA, 1997, pp. 1–7.
Citing Literature
Wiley Encyclopedia of Electrical and Electronics Engineering
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