Scanning Electrochemical Probe Lithography for Ultra-Precision Machining of Micro-Optical Elements with Freeform Curved Surface
Hantao Xu
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
Search for more papers by this authorCorresponding Author
Lianhuan Han
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
E-mail: [email protected]
Search for more papers by this authorJianan Huang
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
Search for more papers by this authorBingqian Du
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
Search for more papers by this authorDongping Zhan
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
Search for more papers by this authorHantao Xu
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
Search for more papers by this authorCorresponding Author
Lianhuan Han
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
E-mail: [email protected]
Search for more papers by this authorJianan Huang
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
Search for more papers by this authorBingqian Du
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
Search for more papers by this authorDongping Zhan
Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology, State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS), Fujian Science & Technology Innovation Laboratory for Energy Materials of China, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005 China
Search for more papers by this authorAbstract
Two challenges should be overcome for the ultra-precision machining of micro-optical element with freeform curved surface: one is the intricate geometry, the other is the hard-to-machining optical materials due to their hardness, brittleness or flexibility. Here scanning electrochemical probe lithography (SECPL) is developed, not only to meet the machining need of intricate geometry by 3D direct writing, but also to overcome the above mentioned mechanical properties by an electrochemical material removal mode. Through the electrochemical probe a localized anodic voltage is applied to drive the localized corrosion of GaAs. The material removal rate is obtained as a function of applied voltage, motion rate, scan segment, etc. Based on the material removal function, an arbitrary geometry can be converted to a spatially distributed voltage. Thus, a series of micro-optical element are fabricated with a machining accuracy in the scale of 100 s of nanometers. Notably, the spiral phase plate shows an excellent performance to transfer parallel light to vortex beam. SECPL demonstrates its excellent controllability and accuracy for the ultra-precision machining of micro-optical devices with freeform curved surface, providing an alternative chemical approach besides the physical and mechanical techniques.
Conflict of Interest
The authors declare no conflict of interest.
Open Research
Data Availability Statement
The data that support the findings of this study are available from the corresponding author upon reasonable request.
Supporting Information
| Filename | Description |
|---|---|
| smll202402743-sup-0001-SuppMat.docx30.5 MB | Supporting Information |
Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.
References
- 1F. Hui, C. Wen, S. Chen, E. Koren, R. Dechter, D. Lewis, M. Lanza, Adv. Funct. Mater. 2019, 30, 1902776.
- 2Z. Shi, A. Y. Zhu, Z. Li, Y.-W. Huang, W. T. Chen, C.-W. Qiu, F. Capasso, Sci. Adv. 2020, 6, eaba3367.
- 3S. Kumar, Z. Tong, X. Jiang, Int. J. Extreme Manufact. 2022, 4, 032004.
10.1088/2631-7990/ac7617 Google Scholar
- 4M. Xu, Q. He, M. Pu, F. Zhang, L. Li, D. Sang, Y. Guo, R. Zhang, X. Li, X. Ma, X. Luo, Adv. Mater. 2022, 34, 2108709.
- 5Z. Zhang, J. Yan, T. Kuriyagawa, Int. J. Extreme Manufact. 2019, 1, 022001.
- 6F. Fang, Int. J. Extreme Manufact. 2020, 2, 030201.
10.1088/2631-7990/aba495 Google Scholar
- 7J. Wang, Y. Yan, Z. Li, Y. Geng, Int. J. Machine Tools Manufact. 2021, 162, 103701.
- 8J. Wang, Y. Yan, Z. Li, Y. Geng, X. Luo, P. Fan. Preci. Eng. 2021, 72, 480.
- 9A. Grushina, Adv. Opt. Technol. 2019, 8, 163.
- 10Z. Gan, H. Feng, L. Chen, S. Min, C. Liang, M. Xu, Z. Jiang, Z. Sun, C. Sun, D. Cui, W.-D. Li Light, Sci. Appll. 2022, 11, 89.
- 11S. Zhang, Y. Zhou, H. Zhang, Z. Xiong, S. To, Int. J. Machine Tools Manufact. 2019, 142, 16.
- 12D. Zhan, L. Han, J. Zhang, Q. He, Z.-W. Tian, Z.-Q. Tian, Chem. Soc. Rev. 2017, 46, 1526.
- 13L. Han, M. M. Sartin, Z.-Q. Tian, D. Zhan, Z.-W. Tian, Curr. Opin. Electrochem. 2020, 22, 80.
- 14G. Liu, L. Chen, J. Liu, M. Qiu, Z. Xie, J. Chang, Y. Zhang, P. Li, D. Y. Lei, Z. Zheng, Adv. Mater. 2018, 30, 1801772.
- 15J. K. Schoer, F. P. Zamborini, R. M. Crooks, J. Phys. Chem. 1996, 100, 11086.
- 16M. M. Rahman, C. L. Tolbert, P. Saha, J. M. Halpern, C. M. Hill, ACS Nano 2022, 16, 21275.
- 17D. Yang, L. Han, Y. Yang, L.-B. Zhao, C. Zong, Y.-F. Huang, D. Zhan, Z.-Q. Tian, Angew. Chem., Int. Ed. 2011, 50, 8679.
- 18R. D. Piner, J. Zhu, F. Xu, S. Hong, C. A. Mirkin, Science 1999, 283, 661.
- 19E. Oh, R. Golnabi, D. A. Walker, C. A. Mirkin, Small 2021, 17, 2100662.
- 20L. Han, Y. Wang, M. M. Sartin, D. Zhan, Z.-Q. Tian, ACS Appl. Electron. Mater. 2021, 3, 437.
- 21L. Han, Z. Hu, M. M. Sartin, X. Wang, X. Zhao, Y. Cao, Y. Yan, D. Zhan, Z.-Q. Tian, Angew. Chem., Int. Ed. 2020, 59, 21129.
- 22E. Torralba, M. Halbwax, T. El Assimi, M. Fouchier, V. Magnin, J. Harari, J.-P. Vilcot, S. Le Gall, R. Lachaume, C. Cachet-Vivier, S. Bastide, Electrochem. Commun. 2017, 76, 79.
- 23J. H. Shin, H. Rhu, Y. B. Ji, S. J. Oh, W. Lee, ACS Appl. Mater. Interfaces 2020, 12, 50703.
- 24K. Kim, B. Ki, K. Choi, J. Oh, ACS Nano 2019, 13, 13465.
- 25W. Sun, H. Xu, L. Han, C. Wang, Z. Ye, J.-J. Su, Y.-F. Wu, S. Luo, D. Zhan, Electrochim. Acta 2023, 462, 142700.
- 26B. Liu, L. Han, H. Xu, J. J. Su, D. Zhan, Chem. Asian J. 2023, 18, 202300491.
10.1002/asia.202300491 Google Scholar
- 27H. Xu, L. Han, J.-J. Su, Z.-Q. Tian, D. Zhan, Sci. China Chem. 2022, 65, 810.
- 28A. Sharstniou, S. Niauzorau, A. L. Hardison, M. Puckett, N. Krueger, J. D. Ryckman, B. Azeredo, Adv. Mater. 2022, 34, 2206608.
- 29C. Guo, L. Zhang, M. M. Sartin, L. Han, Z.-W. Tian, Z.-Q. Tian, D. Zhan, Chem. Sci. 2019, 10, 5893.
- 30T. Sugita, K. Hiramatsu, S. Ikeda, M. Matsumura, ACS Appl. Mater. Interfaces 2013, 5, 2580.
- 31T. Sugita, C.-L. Lee, S. Ikeda, M. Matsumura, ACS Appl. Mater. Interfaces 2011, 3, 2417.
- 32T. Sugita, K. Hiramatsu, S. Ikeda, M. Matsumura, ACS Appl. Mater. Interfaces 2013, 5, 1262.
- 33B. Ki, K. Kim, K. Choi, J. Oh, Sci. Rep. 2020, 10, 13411.
- 34Y. Huang, J. Luo, D. G. Ivey, Mater. Chem. Phys. 2005, 93, 429.
- 35X. Wang, Z. Nie, Y. Liang, J. Wang, T. Li, B. Jia, Nanophotonics 2018, 7, 1533.
- 36V. Parigi, V. D'ambrosio, C. Arnold, L. Marrucci, F. Sciarrino, J. Laurat, Nat. Commun. 2015, 6, 7706.
- 37P. S. Tan, X.-C. Yuan, G. H. Yuan, Q. Wang, Appl. Phys. Lett. 2010, 97, 241109.
- 38T. F. Scott, B. A. Kowalski, A. C. Sullivan, C. N. Bowman, R. R. Mcleod, Science 2009, 324, 913.
- 39M. Padgett, R. Bowman, Nat. Photonics 2011, 5, 343.
- 40Z. Xie, T. Lei, F. Li, H. Qiu, Z. Zhang, H. Wang, C. Min, L. Du, Z. Li, X. Yuan, Light Sci. Appl. 2018, 7, 18001.
- 41Y. Shen, X. Wang, Z. Xie, C. Min, X. Fu, Q. Liu, M. Gong, X. Yuan, Light Sci. Appl. 2019, 8, 90.
- 42K. Sueda, G. Miyaji, N. Miyanaga, M. Nakatsuka, Opt. Express 2004, 12, 3548.
- 43Z. Liu, Y. Liu, Y. Ke, Y. Liu, W. Shu, H. Luo, S. Wen, Photon. Res. 2016, 5, 15.
- 44S. M. Lloyd, M. Babiker, G. Thirunavukkarasu, J. Yuan, Rev. Mod. Phys. 2017, 89, 035004.
- 45M. Q. Mehmood, S. Mei, S. Hussain, K. Huang, S. Y. Siew, L. Zhang, T. Zhang, X. Ling, H. Liu, J. Teng, A. Danner, S. Zhang, C. W. Qiu, Adv. Mater. 2016, 28, 2533.
