Phosphane-Stabilized CuI and AgI Silanes†
Dedicated to Professor Hans Bock on the occasion of his 60th birthday
Abstract
The CuSi bond in 1a is 2.34 Å long; 1a is the first neutral compound containing this structural element. Compound 1a is formed in 65% yield by reaction of CuCl with Ph3SiLi and Me3P (1:1:3) in THF. Compound 1b, the first compound with an AgSi bond, can be prepared in a similar way.
