Volume 250, Issue 12
Cover Picture
Free Access

Bottom-up assembly of nano-carbon devices by dielectrophoresis (Phys. Status Solidi B 12/2013)

Aravind Vijayaraghavan

Corresponding Author

Aravind Vijayaraghavan

School of Materials, The University of Manchester, Manchester, M13 9PL UK

Corresponding author: e-mail [email protected], Phone: +44 161275 0136, Fax: +44 161275 4527Search for more papers by this author
First published: 04 December 2013

Graphical Abstract

In the past decade, an unconventional approach to large-scale fabrication of carbon-nanotube and graphene devices has emerged, namely, dielectrophoretic (DEP) assembly. This technique has now been demonstrated in wafer-scale assembly of nano-carbon electronic devices, sensors, opto-electronic devices and even suspended structures. It has also served as an enabling tool for a number of experiments which might otherwise not be possible. A detailed review of developments in DEP assembly of nano-carbons is presented as a Feature Article by Aravind Vijayaraghavan (pp. 2505–2517). The cover image is an artist's concept of some typical carbon-nanotube and graphene devices assembled by DEP (image courtesy N. Clark).

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