Volume 216, Issue 17 1900167
Original Paper

On a Novel Source Technology for Deep Aluminum Diffusion for Silicon Power Electronics

Gudrun Rattmann

Gudrun Rattmann

Fraunhofer Institute for Integrated Systems and Device Technology IISB, Schottkystrasse 10, 91058 Erlangen, Germany

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Peter Pichler

Corresponding Author

Peter Pichler

Fraunhofer Institute for Integrated Systems and Device Technology IISB, Schottkystrasse 10, 91058 Erlangen, Germany

Chair of Electron Devices, University of Erlangen-Nuremberg, Cauerstrasse 6, 91058 Erlangen, Germany

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Tobias Erlbacher

Tobias Erlbacher

Fraunhofer Institute for Integrated Systems and Device Technology IISB, Schottkystrasse 10, 91058 Erlangen, Germany

Chair of Electron Devices, University of Erlangen-Nuremberg, Cauerstrasse 6, 91058 Erlangen, Germany

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First published: 04 June 2019

Abstract

For the realization of high breakdown voltages in power electronics, a low-cost technology is developed, which allows the deep diffusion of aluminum from a physically deposited source. The approach requires only standard process steps that are already established in the manufacturing of silicon power devices. The sheet concentration of the diffusion profiles exceeds, with 8  ×  1013 cm−2, the ones of comparable implanted and annealed profiles by up to a factor of two. A full numerical analysis of the resulting profiles is provided.

Conflict of Interest

The authors declare no conflict of interest.

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