Volume 203, Issue 9 pp. 2172-2175
Original Paper

Behaviour of the AlN cap during GaN implantation of rare earths and annealing

Florence Gloux

Corresponding Author

Florence Gloux

SIFCOM, UMR 6176 CNRS-ENSICAEN, 6 Boulevard du Maréchal Juin, 14050 Caen, France

Phone: +33 (0)2 31 45 26 63, Fax: +33 (0)2 31 45 26 60Search for more papers by this author
Tomasz Wójtowicz

Tomasz Wójtowicz

SIFCOM, UMR 6176 CNRS-ENSICAEN, 6 Boulevard du Maréchal Juin, 14050 Caen, France

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Pierre Ruterana

Pierre Ruterana

SIFCOM, UMR 6176 CNRS-ENSICAEN, 6 Boulevard du Maréchal Juin, 14050 Caen, France

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K. Lorenz

K. Lorenz

Instituto Tecnológico e Nuclear, EN10, 2686-953 Sacavém, Portugal

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E. Alves

E. Alves

Instituto Tecnológico e Nuclear, EN10, 2686-953 Sacavém, Portugal

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First published: 10 July 2006
Citations: 8

Abstract

The structural evolution of 10 nm AlN caps grown on GaN layers has been investigated by transmission electron microscopy (TEM) and scanning electron microscopy (SEM) after growth, and implantation by rare earths ions and annealing at high temperature. The AlN cap relaxation is shown to take place by pinholes formation. During annealing at 1300 °C, pinhole-free areas of the AlN cap protect the GaN layer and allow efficient optical activation of the rare earths dopants. Through pinholes, an explosive dissociation of the GaN layer occurs. (© 2006 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

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