Volume 17, Issue 1 1900004
FULL PAPER

Humidification effect of air plasma effluent gas on suppressing conidium germination of a plant pathogenic fungus in the liquid phase

Keisuke Shimada

Keisuke Shimada

Department of Electronic Engineering, Tohoku University, Sendai, Japan

Keisuke Shimada and Keisuke Takashima contributed equally to this work.

Search for more papers by this author
Keisuke Takashima

Corresponding Author

Keisuke Takashima

Department of Electronic Engineering, Tohoku University, Sendai, Japan

Keisuke Shimada and Keisuke Takashima contributed equally to this work.

Correspondence Keisuke Takashima, Department of Electronic Engineering, Tohoku University, 6-6-05 Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan.

Email: [email protected]

Search for more papers by this author
Yutaka Kimura

Yutaka Kimura

Department of Electronic Engineering, Tohoku University, Sendai, Japan

Search for more papers by this author
Kenji Nihei

Kenji Nihei

Department of Electronic Engineering, Tohoku University, Sendai, Japan

Search for more papers by this author
Hideaki Konishi

Hideaki Konishi

Department of Electronic Engineering, Tohoku University, Sendai, Japan

Search for more papers by this author
Toshiro Kaneko

Toshiro Kaneko

Department of Electronic Engineering, Tohoku University, Sendai, Japan

Search for more papers by this author
First published: 25 September 2019
Citations: 18

Abstract

Increase of the water flow rate into atmospheric pressure air discharge plasma for humidification can significantly improve suppressing conidium germination of a plant pathogenic fungus in the liquid phase by its effluent gas exposure. The role of the introduced water includes enhancement of hydrogen supply to the plasma and cooling of the plasma effluent gas. The hydrogen-containing precursors for antibacterial species generation are experimentally increased. The gas cooling by the latent heat assists dinitrogen pentoxide density in the gas phase, a suggested precursor for antibacterial species generation near the liquid surface. This suggested near-surface reaction is a second-order reaction, generally requiring lower precursors concentrations and leading to less residues, thus it can be an important process for agricultural applications.

The full text of this article hosted at iucr.org is unavailable due to technical difficulties.