Volume 42, Issue 21 pp. 3849-3858
Article

Glass transition and relaxation behavior of epoxy nanocomposites

Yangyang Sun

Yangyang Sun

School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332

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Zhuqing Zhang

Zhuqing Zhang

School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332

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Kyoung-Sik Moon

Kyoung-Sik Moon

School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332

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C. P. Wong

Corresponding Author

C. P. Wong

School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332

School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332Search for more papers by this author
First published: 16 September 2004
Citations: 316

Abstract

With advances in nanoscience and nanotechnology, there is increasing interest in polymer nanocomposites, both in scientific research and for engineering applications. Because of the small size of nanoparticles, the polymer–filler interface property becomes a dominant factor in determining the macroscopic material properties of the nanocomposites. The glass-transition behaviors of several epoxy nanocomposites have been investigated with modulated differential scanning calorimetry. The effect of the filler size, filler loading, and dispersion conditions of the nanofillers on the glass-transition temperature (Tg) have been studied. In comparison with their counterparts with micrometer-sized fillers, the nanocomposites show a Tg depression. For the determination of the reason for the Tg depression, the thermomechanical and dielectric relaxation processes of the silica nanocomposites have been investigated with dynamic mechanical analysis and dielectric analysis. The Tg depression is related to the enhanced polymer dynamics due to the extra free volume at the resin–filler interface. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3849–3858, 2004

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