Volume 11, Issue 3 pp. 128-131

InGaP/InAlAs/InGaAs HEMT using a Pt-based Schottky gate

M. Amano

M. Amano

Toshiba Materials and Devices Research Laboratories, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan

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S. Fujita

Corresponding Author

S. Fujita

Toshiba Materials and Devices Research Laboratories, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan

Angstrom Technology Partnership, 1-1-4 Higashi, Tsukubu, Ibaraki 305, JapanSearch for more papers by this author
S. Hosoi

S. Hosoi

Toshiba Microelectronics Center, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan

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T. Noda

T. Noda

Toshiba Materials and Devices Research Laboratories, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan

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A. Sasaki

A. Sasaki

Toshiba Materials and Devices Research Laboratories, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan

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Y. Ashizawa

Y. Ashizawa

Toshiba Materials and Devices Research Laboratories, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan

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Abstract

Low leakage current and high ϕB for a Schottky contact on a thin-In-GaP/InAlAs heterostructure were obtained using annealed Pt Schottky contact metal. An InP-based HEMT using the annealed Pt-based-metals/thin-InGaP/InAlAs Schottky gate contact exhibited dc and rf performance comparable to that of a conventional InP-based HEMT. © 1996 John Wiley & Sons, Inc.

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