Volume 2009, Issue 1 308949
Research Article
Open Access

Plasma-Induced Damage on the Reliability of Hf-Based High-k/Dual Metal-Gates Complementary Metal Oxide Semiconductor Technology

Wu-Te Weng

Corresponding Author

Wu-Te Weng

Institute of Electronics, National Chiao Tung University, 1001 Ta-Hsueh Road, Hsinchu 300, Taiwan nctu.edu.tw

Search for more papers by this author
Yao-Jen Lee

Yao-Jen Lee

National Nano Device Laboratories, Science-Based Industrial Park, 26 Prosperity Road 1, Hsinchu 30078, Taiwan ndl.org.tw

Search for more papers by this author
Horng-Chih Lin

Horng-Chih Lin

Institute of Electronics, National Chiao Tung University, 1001 Ta-Hsueh Road, Hsinchu 300, Taiwan nctu.edu.tw

National Nano Device Laboratories, Science-Based Industrial Park, 26 Prosperity Road 1, Hsinchu 30078, Taiwan ndl.org.tw

Search for more papers by this author
Tiao-Yuan Huang

Tiao-Yuan Huang

Institute of Electronics, National Chiao Tung University, 1001 Ta-Hsueh Road, Hsinchu 300, Taiwan nctu.edu.tw

Search for more papers by this author
First published: 14 December 2009
Citations: 3
Academic Editor: Paul K. Chu

Abstract

This study examines the effects of plasma-induced damage (PID) on Hf-based high-k/dual metal-gates transistors processed with advanced complementary metal-oxide-semiconductor (CMOS) technology. In addition to the gate dielectric degradations, this study demonstrates that thinning the gate dielectric reduces the impact of damage on transistor reliability including the positive bias temperature instability (PBTI) of n-channel metal-oxide-semiconductor field-effect transistors (NMOSFETs) and the negative bias temperature instability (NBTI) of p-channel MOSFETs. This study shows that high-k/metal-gate transistors are more robust against PID than conventional SiO2/poly-gate transistors with similar physical thickness. Finally this study proposes a model that successfully explains the observed experimental trends in the presence of PID for high-k/metal-gate CMOS technology.

The full text of this article hosted at iucr.org is unavailable due to technical difficulties.