Volume 13, Issue 1-4 051736 pp. 131-134
Article
Open Access

An Analytic Expression of Thermal Diffusion Coefficient for the Hydrodynamic Simulation of Semiconductor Devices

Ting-Wei Tang

Corresponding Author

Ting-Wei Tang

Department of Electrical and Computer Engineering University of Massachusetts Amherst, MA 01003, USA , umass.edu

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Xinlin Wang

Xinlin Wang

Department of Electrical and Computer Engineering University of Massachusetts Amherst, MA 01003, USA , umass.edu

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Haitao Gan

Haitao Gan

Department of Electrical and Computer Engineering University of Massachusetts Amherst, MA 01003, USA , umass.edu

Stanford University Stanford, CA 94305, USA , stanford.edu

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Meikei Ieong

Meikei Ieong

lBM SRDC East Fishkill Facility Hopewell Junction NY 12533, USA

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First published: 01 January 2001
Citations: 7

Abstract

A new analytical expression of thermal diffusion coefficient DT is derived. To the firstorder approximation, it is given by (1+η)-1(D/Tn) rather than (1–η)(D/Tn) where η=–(Tn/η*)(η*/Tn ) and η* represents the temperature-dependent bulk mobility. This new transport coefficient is implemented in our 2-D hydrodynamic device simulator and it seems to produce more reasonable results.

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