Volume 2, Issue 4 057617 pp. 375-388
Article
Open Access

Designing Interconnection Networks for Multi-level Packaging

M. T. Raghunath

M. T. Raghunath

Computer Science Division University of California at Berkeley Berkeley, CA 94720, USA , berkeley.edu

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Abhiram Ranade

Abhiram Ranade

Computer Science Division University of California at Berkeley Berkeley, CA 94720, USA , berkeley.edu

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First published: 01 January 1995

Abstract

A central problem in building large scale parallel machines is the design of the interconnection network. Interconnection network design is largely constrained by packaging technology. We start with a generic set of packaging restrictions and evaluate different network organizations under a random traffic model. Our results indicate that customizing the network topology to the packaging constraints is useful. Some of the general principles that arise out of this study are: 1) Making the networks denser at the lower levels of the packaging hierarchy has a significant positive impact on global communication performance, 2) It is better to organize a fixed amount of communication bandwidth as a smaller number of high bandwidth channels, 3) Providing the processors with the ability to tolerate latencies (by using multithreading) is very useful in improving performance.

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