Microfluidic chip sealing using femtosecond lasers

A femtosecond laser can be used in several steps in the fabrication of microfluidic chips with flexibility and repeatability. However, it seems important to combine it with a beam shaping technique in one particular step: the sealing of the various components of the chip. Cailabs and Lasea have collaborated to demonstrate the benefits of using a custom beam profile compared to a Gaussian beam during chip welding. The results: improved quality and process speed increased nine times.