Volume 53, Issue 11 pp. 2505-2508

Performance analysis of metallic carbon nanotubes as nanotechnology circuit interconnects

Vidur Parkash

Vidur Parkash

Department of Electrical and Computer Engineering Michigan Technological University, Houghton, MI 49931

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Ashok K. Goel

Corresponding Author

Ashok K. Goel

Department of Electrical and Computer Engineering Michigan Technological University, Houghton, MI 49931

Department of Electrical and Computer Engineering Michigan Technological University, Houghton, MI 49931Search for more papers by this author
First published: 19 August 2011
Citations: 1

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Abstract

Carbon nanotubes (CNTs) have emerged as a potential nanoelectronic material that can replace traditional copper as the material for very large scale integrated circuits (VLSI) interconnects.In this article, we have quantified the performance expected out of CNTs-based interconnect systems based on realistic characterization of their Tomonaga Luttinger theory-based transmission line model. We have presented performance estimates for bus systems consisted of single-walled nanotubes and crystalline bundles of CNTs. Results indicate that the bundles offer at leasta 10 times performance advantage over isolated nanotubes. However, this is at the expense of larger signal damping associated with them. Published 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:2505–2508, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.26314

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