Volume 205, Issue 11 pp. 1559-1568
Full Paper

Structural Effect on Thermal Cure and Property of Naphthalene-Based Epoxies: Preparation and Characterization

Kai Xu

Kai Xu

Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, P.O. Box 1122, Guangzhou 510650, China

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Mingcai Chen

Corresponding Author

Mingcai Chen

Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, P.O. Box 1122, Guangzhou 510650, China

Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, P.O. Box 1122, Guangzhou 510650, China. Fax: +86 20 85231058Search for more papers by this author
Xiuju Zhang

Xiuju Zhang

Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, P.O. Box 1122, Guangzhou 510650, China

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Kui Zhang

Kui Zhang

Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, P.O. Box 1122, Guangzhou 510650, China

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First published: 22 July 2004
Citations: 11

Abstract

Summary: Three naphthalene-based epoxy monomers containing different size of linkages between two naphthalene rings: CC covalent bond (1), methylene (2), cycloaliphatic hydrocarbon derived from limonene (3) were prepared, and the effect of molecular structure on thermal cure behavior and property analyzed. Judged from the combination of the dynamic DSC and isothermal FTIR results, the cure reactivities were found to increase in the order of 1 > 2 > 3 when dicyandiamide was used in the curing systems, and the situation was slightly different in the monomer/4,4′-methylenedianiline systems. The differences in reactivity as well as in thermal and mechanical properties for the epoxies can be attributed to the differences of configuration and conformational changes during the formation of crosslinked networks. These thermosets exhibited high glass transition temperature (Tg) and had excellent thermal oxidative resistance.

image

DSC thermograms for epoxy/dicyandiamide systems at a heating rate of 10 °C · min−1.

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