Volume 29, Issue 2 pp. 157-165
Research Article

High-frequency modeling of Cu-graphene heterogeneous interconnects

Wen-Sheng Zhao

Corresponding Author

Wen-Sheng Zhao

Centre for Optical and Electromagnetic Research, State Key Lab of Modern Optical Instrumentation, Zhejiang University, Hangzhou, 310058 China

Key Laboratory of RF Circuits and Systems of Ministry of Education, Microelectronics CAD Center, Hangzhou Dianzi University, Hangzhou, 310018 China

Correspondence to: Wen-Sheng Zhao, Centre for Optical and Electromagnetic Research, State Key Lab of Modern Optical Instrumentation, Zhejiang University, Hangzhou 310058, China

E-mail: [email protected]; [email protected]

Search for more papers by this author
Rui Zhang

Rui Zhang

Centre for Optical and Electromagnetic Research, State Key Lab of Modern Optical Instrumentation, Zhejiang University, Hangzhou, 310058 China

Search for more papers by this author
Yuan Fang

Yuan Fang

Centre for Optical and Electromagnetic Research, State Key Lab of Modern Optical Instrumentation, Zhejiang University, Hangzhou, 310058 China

Search for more papers by this author
Wen-Yan Yin

Wen-Yan Yin

Centre for Optical and Electromagnetic Research, State Key Lab of Modern Optical Instrumentation, Zhejiang University, Hangzhou, 310058 China

Search for more papers by this author
Gaofeng Wang

Gaofeng Wang

Key Laboratory of RF Circuits and Systems of Ministry of Education, Microelectronics CAD Center, Hangzhou Dianzi University, Hangzhou, 310018 China

Search for more papers by this author
Kai Kang

Kai Kang

University of Electronic Science and Technology, Chengdu, 611731 China

Search for more papers by this author
First published: 03 March 2015
Citations: 2

Summary

One novel interconnect scheme consisting of both Cu and graphene sheet is proposed in this paper, with the advantages of both materials exploited greatly. It is shown that the introduction of graphene layers in such heterogeneous interconnect scheme can reduce its effective resistance and thereby improve its transmission performance. On the other hand, it is also demonstrated that both coated and double-coated structures possess better electrical performance than that of the sandwich one at high frequencies, because the graphene is placed at the interconnect surface where current is crowded. With the help of Partial Element Equivalent Circuit method, together with equivalent circuit technique, the transmission characteristics of some Cu-graphene interconnects are captured and compared with that of Cu wire, and the advantages of such heterogeneous interconnects can be enlarged with the advanced technology. Copyright © 2015 John Wiley & Sons, Ltd.

The full text of this article hosted at iucr.org is unavailable due to technical difficulties.