Investigation of ureido-attached vinyl MQ silicone resin on tracking and erosion resistance of addition-cure liquid silicone rubber
Hongqiang Li
School of Materials Science and Engineering, Key Laboratory of Guangdong Province for High Property and Functional Polymer Materials, South China University of Technology, Guangzhou, 510640 China
Search for more papers by this authorYanping Li
School of Materials Science and Engineering, Key Laboratory of Guangdong Province for High Property and Functional Polymer Materials, South China University of Technology, Guangzhou, 510640 China
Search for more papers by this authorXuejun Lai
School of Materials Science and Engineering, Key Laboratory of Guangdong Province for High Property and Functional Polymer Materials, South China University of Technology, Guangzhou, 510640 China
Search for more papers by this authorCorresponding Author
Hongwei Cao
State Grid Henan Electric Power Research Institute, Zhengzhou, 450052 China
Correspondence to: H. Cao (E-mail: [email protected]); R. Yuan (E-mail: [email protected]); and X. Zeng (E-mail: [email protected])Search for more papers by this authorCorresponding Author
Renxu Yuan
Guangdong Xinhuayue Petrochemical Group Corporation, Maoming, 525000 China
Correspondence to: H. Cao (E-mail: [email protected]); R. Yuan (E-mail: [email protected]); and X. Zeng (E-mail: [email protected])Search for more papers by this authorCorresponding Author
Xingrong Zeng
School of Materials Science and Engineering, Key Laboratory of Guangdong Province for High Property and Functional Polymer Materials, South China University of Technology, Guangzhou, 510640 China
Correspondence to: H. Cao (E-mail: [email protected]); R. Yuan (E-mail: [email protected]); and X. Zeng (E-mail: [email protected])Search for more papers by this authorHongqiang Li
School of Materials Science and Engineering, Key Laboratory of Guangdong Province for High Property and Functional Polymer Materials, South China University of Technology, Guangzhou, 510640 China
Search for more papers by this authorYanping Li
School of Materials Science and Engineering, Key Laboratory of Guangdong Province for High Property and Functional Polymer Materials, South China University of Technology, Guangzhou, 510640 China
Search for more papers by this authorXuejun Lai
School of Materials Science and Engineering, Key Laboratory of Guangdong Province for High Property and Functional Polymer Materials, South China University of Technology, Guangzhou, 510640 China
Search for more papers by this authorCorresponding Author
Hongwei Cao
State Grid Henan Electric Power Research Institute, Zhengzhou, 450052 China
Correspondence to: H. Cao (E-mail: [email protected]); R. Yuan (E-mail: [email protected]); and X. Zeng (E-mail: [email protected])Search for more papers by this authorCorresponding Author
Renxu Yuan
Guangdong Xinhuayue Petrochemical Group Corporation, Maoming, 525000 China
Correspondence to: H. Cao (E-mail: [email protected]); R. Yuan (E-mail: [email protected]); and X. Zeng (E-mail: [email protected])Search for more papers by this authorCorresponding Author
Xingrong Zeng
School of Materials Science and Engineering, Key Laboratory of Guangdong Province for High Property and Functional Polymer Materials, South China University of Technology, Guangzhou, 510640 China
Correspondence to: H. Cao (E-mail: [email protected]); R. Yuan (E-mail: [email protected]); and X. Zeng (E-mail: [email protected])Search for more papers by this authorABSTRACT
With the growing incidence of extreme climate and serious pollution, the capability to resist high-voltage arc discharge has been considered as one of crucial performances for silicone rubber in the field of electrical power. Herein, to enhance the tracking and erosion resistance of addition-cure liquid silicone rubber (ALSR), a kind of ureido-attached vinyl MQ silicone resin [hydrolytic condensation products of monofunctional silane (M) and tetrafunctional silane (Q)] (U-VMQ) was synthesized. The chemical structure of U-VMQ was characterized by Fourier transform infrared spectroscopy and proton nuclear magnetic resonance, and the effects of U-VMQ on the mechanical properties, thermal stability, and tracking and erosion resistance of ALSR were investigated. The results showed that U-VMQ was beneficial for the improvement of mechanical properties and thermal stability of ALSR. With 2 phr of U-VMQ containing 2.5 wt % of vinyl content, the ALSR successfully passed the inclined plane tracking at 4.5 kV, and the electrical erosion rate was only 0.13%. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47360.
Supporting Information
| Filename | Description |
|---|---|
| app47360-sup-0001-supinfo.docWord document, 82.5 KB |
Table S1 Characteristic parameters from TG and DTG curves of ALSR samples with 2 phr U-VMQ containing different content of vinyl groups. Table S2. Characteristic parameters from TG and DTG curves of ALSR samples with different contents of U-VMQ containing 2.50 wt % of vinyl content. Figure S1. Possible formation mechanism of Si-C ceramic barrier on ALSR surface. |
Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.
REFERENCES
- 1Emelyanenko, A. M.; Boinovich, L. B.; Bezdomnikov, A. A.; Chulkova, E. V.; Emelyanenko, K. A. ACS Appl. Mater. Interfaces. 2017, 9, 24210.
- 2Yuan, C.; Xie, C.; Li, L.; Xu, X.; Gubanski, S. M. IEEE Trans. Dielectr. Electr. Insul. 2017, 24, 592.
- 3Li, C.; Liu, B.; Gao, Z.; Wang, H.; Liu, M.; Wang, S.; Xiong, C. J. Appl. Polym. Sci. 2018, 135, 46454.
- 4Buontempo, R. C.; Dellallibera, A. A.; Costa, E. C. M.; Pissolato, J.; de Mello, D. R.; Mei, L. H. I. Measurement. 2016, 89, 114.
- 5Wang, Z.; Zhang, X.; Wang, F.; Lan, X. Phosphorus Sulfur. 2017, 192, 109.
- 6Zhang, J.; Feng, S.; Wang, X. J. Appl. Polym. Sci. 2004, 94, 587.
- 7Zhang, Y.; Zhou, Y.; Chen, M.; Zhang, L.; Zhang, X.; Sha, Y. J. Electrostat. 2017, 88, 207.
- 8Li, W.; Gedde, U. W.; Hillborg, H. IEEE Trans. Dielectr. Electr. Insul. 2016, 23, 1156.
- 9Xu, H.; Gong, L.; Wang, X.; Zhao, L.; Pei, Y.; Wang, G.; Liu, Y.; Wu, L.; Jiang, J.; Tang, L. Compos. Part A: Appl. Sci. Manuf. 2016, 91, 53.
- 10Chen, W.; Zeng, X.; Lai, X.; Li, H.; Fang, W.; Hou, F. ACS Appl. Mater. Interfaces. 2016, 8, 21039.
- 11Vas, J. V.; Venkatesulu, B.; Thomas, M. J. IEEE Trans. Dielectr. Electr. Insul. 2012, 19, 91.
- 12Venkatesulu, B.; Thomas, M. J. IEEE Trans. Dielectr. Electr. Insul. 2010, 17, 615.
- 13Ghunem, R. A.; Jayaram, S. H.; Cherney, E. A. IEEE Trans. Dielectr. Electr. Insul. 2015, 22, 14.
- 14Du, B. X.; Guo, Y. G.; Liu, Y.; Tian, L. IEEE Trans. Dielectr. Electr. Insul. 2014, 21, 2146.
- 15Yu, L.; Skov, A. L. Int. J. Smart Nano Mater. 2015, 6, 268.
- 16Ramirez, I.; Cherney, E. A.; Jarayam, S. IEEE Trans. Dielectr. Electr. Insul. 2012, 19, 218.
- 17Pradeep, M. A.; Vasudev, N.; Reddy, P. V.; Khastgir, D. J. Appl. Polym. Sci. 2007, 104, 3505.
- 18Du, B. X.; Xu, H. IEEE Trans. Dielectr. Electr. Insul. 2014, 21, 511.
- 19Zhu, Y.; Otsubo, M.; Honda, C.; Ohno, A. Polym. Test. 2005, 24, 893.
- 20Wang, Z.; Yin, C.; Luo, Y.; Chen, L.; Zhou, Y.; He, C.; Fang, P.; Peng, X.; Huang, Z. J. Appl. Polym. Sci. 2018, 135, 45803.
- 21Seyedmehdi, S. A.; Zhang, H.; Zhu, J. Appl. Surf. Sci. 2012, 258, 2972.
- 22Kumagai, S.; Yoshimura, N. IEEE Trans. Dielectr. Electr. Insul. 2001, 8, 203.
- 23Xue, Y.; Li, X.; Zhang, D.; Wang, H.; Chen, Y.; Chen, Y. Compos. Sci. Technol. 2018, 155, 137.
- 24Schmidt, L. E.; Kornmann, X.; Krivda, A.; Hillborg, H. IEEE Trans. Dielectr. Electr. Insul. 2010, 17, 533.
- 25Fang, W.; Lai, X.; Li, H.; Chen, W.; Zeng, X.; Zhang, L.; Yang, S. Polym. Test. 2014, 37, 19.
- 26Li, Y.; Zeng, X.; Lai, X.; Li, H.; Fang, W. Polym. Test. 2017, 63, 92.
- 27Zhang, Y.; Zeng, X.; Lai, X.; Li, H.; Zhou, Q.; Huang, X. ACS Omega. 2017, 2, 5111.
- 28Chen, D.; Chen, F.; Hu, X.; Zhang, H.; Yin, X.; Zhou, Y. Compos. Sci. Technol. 2015, 117, 307.
- 29Yan, D.; Liu, L.; Song, R. J. Mater. Sci. 2015, 50, 1309.
- 30Zhan, X.; Zhang, J.; Cheng, J.; Shi, L.; Lin, X. J. Therm. Anal. Calorim. 2014, 117, 875.
- 31Vasil'ev, S. G.; Volkov, V. I.; Tatarinova, E. A.; Muzafarov, A. M. Appl. Magn. Reson. 2014, 45, 315.
- 32Otts, D. B.; Heidenreich, E.; Urban, M. W. Polymer. 2005, 46, 8162.
- 33Kim, E. S.; Kim, E. J.; Shim, J. H.; Yoon, J.-S. J. Appl. Polym. Sci. 2008, 110, 1263.
- 34Delebecq, E.; Hamdani-Devarennes, S.; Raeke, J.; Lopez Cuesta, J. M.; Ganachaud, F. ACS Appl. Mater. Interfaces. 2011, 3, 869.
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