Self-healing Ag/epoxy electrically conductive adhesive using encapsulated epoxy-amine healing chemistry
Yu Tao
Department of Materials Science, Fudan University, Shanghai, 200433 People's Republic of China
Department of Materials Science and Engineering, Changzhou University, Changzhou, 213614 People's Republic of China
Search for more papers by this authorYu Chang
Department of Materials Science, Fudan University, Shanghai, 200433 People's Republic of China
Search for more papers by this authorYuxiao Tao
Department of Materials Science and Engineering, Changzhou University, Changzhou, 213614 People's Republic of China
Search for more papers by this authorCorresponding Author
Haiping Wu
Department of Materials Science and Engineering, Changzhou University, Changzhou, 213614 People's Republic of China
Correspondence to: Z. Yang (E-mail: [email protected]) and H. Wu (E-mail: [email protected])Search for more papers by this authorCorresponding Author
Zhenguo Yang
Department of Materials Science, Fudan University, Shanghai, 200433 People's Republic of China
Correspondence to: Z. Yang (E-mail: [email protected]) and H. Wu (E-mail: [email protected])Search for more papers by this authorYu Tao
Department of Materials Science, Fudan University, Shanghai, 200433 People's Republic of China
Department of Materials Science and Engineering, Changzhou University, Changzhou, 213614 People's Republic of China
Search for more papers by this authorYu Chang
Department of Materials Science, Fudan University, Shanghai, 200433 People's Republic of China
Search for more papers by this authorYuxiao Tao
Department of Materials Science and Engineering, Changzhou University, Changzhou, 213614 People's Republic of China
Search for more papers by this authorCorresponding Author
Haiping Wu
Department of Materials Science and Engineering, Changzhou University, Changzhou, 213614 People's Republic of China
Correspondence to: Z. Yang (E-mail: [email protected]) and H. Wu (E-mail: [email protected])Search for more papers by this authorCorresponding Author
Zhenguo Yang
Department of Materials Science, Fudan University, Shanghai, 200433 People's Republic of China
Correspondence to: Z. Yang (E-mail: [email protected]) and H. Wu (E-mail: [email protected])Search for more papers by this authorABSTRACT
In this study, a dual-microcapsule epoxy-amine self-healing concept is used for electrically conductive adhesives (ECAs). It provides the ECA samples with the ability to recover mechanical and electrical properties automatically. Epoxy and amine microcapsules were prepared and incorporated into silver/epoxy ECAs. The healing efficiency and bulk resistivity of the undamaged, damaged, and healed specimens were measured, respectively. The optimal loading of the epoxy and amine microcapsules is 6 wt % (weight ratio 1.05), and the bulk resistivity of the healed specimens is 3.4 × 10−3 Ω cm. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015, 132, 41483.
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February 15, 2015
