Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites
Tung-Lin Li
Department of Materials Science and Engineering, Center for Micro/Nano Science and Technology, National Cheng-Kung University, No.1, University Road, Tainan City 701 Tainan, Taiwan, Republic of China
Search for more papers by this authorCorresponding Author
Steve Lien-Chung Hsu
Department of Materials Science and Engineering, Center for Micro/Nano Science and Technology, National Cheng-Kung University, No.1, University Road, Tainan City 701 Tainan, Taiwan, Republic of China
Department of Materials Science and Engineering, Center for Micro/Nano Science and Technology, National Cheng-Kung University, No.1, University Road, Tainan City 701 Tainan, Taiwan, Republic of China===Search for more papers by this authorTung-Lin Li
Department of Materials Science and Engineering, Center for Micro/Nano Science and Technology, National Cheng-Kung University, No.1, University Road, Tainan City 701 Tainan, Taiwan, Republic of China
Search for more papers by this authorCorresponding Author
Steve Lien-Chung Hsu
Department of Materials Science and Engineering, Center for Micro/Nano Science and Technology, National Cheng-Kung University, No.1, University Road, Tainan City 701 Tainan, Taiwan, Republic of China
Department of Materials Science and Engineering, Center for Micro/Nano Science and Technology, National Cheng-Kung University, No.1, University Road, Tainan City 701 Tainan, Taiwan, Republic of China===Search for more papers by this authorAbstract
A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative-tone photosensitive polyimide (PSPI) precursor. 3-Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes in the polymer. The thermal conductivity of the composite films increased with increasing BN fraction. The thermal conductivity of the PSPI/BN nanocomposite was up to 0.47 W m−1 K−1 for a mixture containing 30 wt % nanosized BN filler in the polyimide matrix. Patterns with a resolution of 30 μm were obtained from the PSPI/BN nanocomposites. The PSPI/BN nanocomposites had excellent thermal properties. Their glass-transition temperatures were above 360°C, and the thermal decomposition temperatures were over 460°C. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011
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