Volume 82, Issue 11 pp. 2750-2759

Preparation and characterization of organosoluble polyimides based on 1,1-bis[4-(3,4-aminophenoxy)phenyl]cyclohexane and commercial aromatic dianhydrides

Chin-Ping Yang

Corresponding Author

Chin-Ping Yang

Department of Chemical Engineering, Tatung University, 40 Chungshan North Rd. 3rd Sec., Taipei 104, Taiwan, Republic of China

Department of Chemical Engineering, Tatung University, 40 Chungshan North Rd. 3rd Sec., Taipei 104, Taiwan, Republic of China===Search for more papers by this author
Ruei-Shin Chen

Ruei-Shin Chen

Department of Chemical Engineering, Tatung University, 40 Chungshan North Rd. 3rd Sec., Taipei 104, Taiwan, Republic of China

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Chien-Wen Yu

Chien-Wen Yu

Department of Chemical Engineering, Tatung University, 40 Chungshan North Rd. 3rd Sec., Taipei 104, Taiwan, Republic of China

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First published: 01 October 2001
Citations: 11

Abstract

A bis(ether amine) III-A containing a cyclohexane cardo group, 1,1-bis[4-(4-aminophenoxy)phenyl]cyclohexane, was synthesized and used as a monomer to prepare polyimides VI-A with six commercial dianhydrides via three different procedures. The intermediate poly(amic acid)s had inherent viscosities of 0.83–1.69 dL g−1 and were thermally or chemically converted into polyimides. Polyimides were also prepared by high-temperature direct polymerization in m-cresol and had inherent viscosities higher than the thermally or chemically cyclodehydrated ones. To improve the solubility of polyimides, six copolyimides were also synthesized from bis(ether amine) III-A with a pair of dianhydrides, which contained 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride or 4,4′-hexafluoroisopropylidenediphthalic anhydride. Series VI-A polyimides were characterized by the good physical properties of their film-forming ability, thermal stability, and tensile properties. A comparative study of the properties, with the corresponding polyimides derived from 2,2-bis[4-(4-aminophenoxy)phenyl]propane, is also presented. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 2750–2759, 2001

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