Volume 8, Issue 2 pp. 613-624
Article
Full Access

Thermal expansion of photomechanical materials

Angelo Colao

Angelo Colao

Target Rock Corporation, Hempstead, New York

Search for more papers by this author
Herbert Becker

Herbert Becker

Allied Research Associates, Concord, Massachusetts

Search for more papers by this author
First published: March/April 1964
Citations: 1

Sponsored by: U.S. Navy Department, Office of Naval Research, Contract NOnr285 (50).

Abstract

A quartz thermal expansion apparatus was developed to measure the thermal expansion of photomechanical plastics. Three different methods of motion measurement correlated with a maximum error of ±1% for three different models of Hysol 4290 epoxy. The thermal expansion of a 30% plasticized epoxy was determined and was found to exhibit essentially the same characteristics as the 4290 epoxy except for a shift in the temperature scale.

The full text of this article hosted at iucr.org is unavailable due to technical difficulties.