Volume 62, Issue 5 pp. 799-803
Article

A high-performance bismaleimide resin with good processing characteristics

Aijuan Gu

Corresponding Author

Aijuan Gu

Department of Chemical Engineering, Northwestern Polytechnical University, Xían, Shaan Xi 710072, People's Republic of China

Department of Chemical Engineering, Northwestern Polytechnical University, Xían, Shaan Xi 710072, People's Republic of China===Search for more papers by this author
Guozheng Liang

Guozheng Liang

Department of Chemical Engineering, Northwestern Polytechnical University, Xían, Shaan Xi 710072, People's Republic of China

Search for more papers by this author
Liwen Lan

Liwen Lan

Department of Chemical Engineering, Northwestern Polytechnical University, Xían, Shaan Xi 710072, People's Republic of China

Search for more papers by this author

Abstract

A new bismaleimide (BMI) resin system, designated 4504, with excellent heat resistance and good mechanical properties for advanced composites was developed. The 4504 resin was made up of 4,4′-bismaleimidodiphenyl methane, diallyl bisphenol A, and desirable catalysts. The reactivity of 4504 was investigated by gel characteristics and differential scanning calorimetry (DSC). Data showed that 4504 had a long work life under 100°C, but would gel within 7 min or 40 s at 140 or 160°C, respectively. The glass transition temperature (Tg) and heat-deflection temperature (HDT) of the cured 4504 resin were 315 and 290°C, respectively, which were much higher than the postcure temperature (200°C). In addition, the cured resin is also tough. Thermogravimetric analysis (TGA) in a nitrogen atmosphere revealed that the neat resin was stable up to 450°C; its char yield at 700°C under anaerobic conditions was 29.4%. Carbon fiber T300 laminates based on 4504 were prepared and characterized. In the case of short-beam (SBS) strength, when tested at 230°C, 51% of the original room temperature strength was retained. © 1996 John Wiley & Sons, Inc.

The full text of this article hosted at iucr.org is unavailable due to technical difficulties.