Volume 2, Issue 4 pp. 337-342
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RHEOLOGICAL MODEL OF SOY DOUGH IN EXTRUSION

A. H. CHEN

A. H. CHEN

Department of Chemical Engineering Research and Pilot Services Industrial Products Group Miles Laboratories, Inc. Elkhart, Indiana 46515

W. L. Clayton Research Center, Anderson Clayton Foods, Richardson, Texas 75080

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Y. C. JAO

Y. C. JAO

Department of Chemical Engineering Research and Pilot Services Industrial Products Group Miles Laboratories, Inc. Elkhart, Indiana 46515

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J. W. LARKIN

J. W. LARKIN

Department of Chemical Engineering Research and Pilot Services Industrial Products Group Miles Laboratories, Inc. Elkhart, Indiana 46515

Department of Food Science and Nutrition, Ohio State University, Columbus, Ohio 43210

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W. E. GOLDSTEIN

W. E. GOLDSTEIN

Department of Chemical Engineering Research and Pilot Services Industrial Products Group Miles Laboratories, Inc. Elkhart, Indiana 46515

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First published: October 1978
Citations: 24

ABSTRACT

A viscosity model of defatted soy dough under various conditions of shear rate, temperature and moisture level in the extrusion process is reported. The model represents the data well within the shear rate range of 50 to 1,000 s−1, the temperature range of 100 °C to 160 °C, and the added moisture range of 22% to 32%. The flow index is determined to be 0.127, and response surfaces of the viscosity are also presented.

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