Volume 257, Issue 2 1900447
Original Paper

High-Temperature Annealing of Sputter-Deposited AlN on (001) Diamond Substrate

Tatsuya Shirato

Tatsuya Shirato

Graduate School of Engineering, Mie University, Mie, 514-8507 Japan

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Yusuke Hayashi

Corresponding Author

Yusuke Hayashi

Graduate School of Engineering Science, Osaka University, Osaka, 560-8531 Japan

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Kenjiro Uesugi

Kenjiro Uesugi

Strategic Planning Office for Regional Revitalization, Mie University, Mie, 514-8507 Japan

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Kanako Shojiki

Kanako Shojiki

Graduate School of Engineering, Mie University, Mie, 514-8507 Japan

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Hideto Miyake

Hideto Miyake

Graduate School of Engineering, Mie University, Mie, 514-8507 Japan

Graduate School of Regional Innovation Studies, Mie University, Mie, 514-8507 Japan

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First published: 05 September 2019
Citations: 4

Abstract

A novel fabrication process of hexagonal aluminum nitride (AlN)/(001) diamond by means of sputtering and high-temperature annealing is proposed. Crystallinity of the AlN is significantly improved by the annealing, leading to full width at half maximum (FWHM) of the AlN(0002) diffraction X-ray rocking curve (XRC) of 1490 arcsec for the AlN thickness of 400 nm. The in-plane epitaxial relationship in AlN/diamond structure is stabilized in the single domain of (0001) [11–20] AlN || (001) [110] diamond on single-crystal diamond substrates with off-cut angle along [110]. Transmission electron microscopy and nano-beam electron diffraction indicate the existence of an epitaxial graphite layer exhibiting an epitaxial relationship of (0001) [11–20] AlN || (1–100) [0001] graphite || (001) [110] diamond. The demonstration of single-domain hexagonal AlN/(001) diamond structure provides a cost-effective, mass production approach for realizing AlxGa1−xN/diamond devices for electronic and optoelectronic applications.

Conflict of Interest

The authors declare no conflict of interest.

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