Volume 33, Issue 3 pp. 427-439
Article
Full Access

LC-Polyimides. XIX. Chiral and thermotropic poly(esterimide)s based on N-(4′-caboxyphenyl)trimellitimide and novel chiral spacers

Hans R. Kricheldorf

Corresponding Author

Hans R. Kricheldorf

Institut für Technische und Makromolekulare Chemie der Universität, Bundesstr. 45, D-20146 Hamburg, Germany

Institut für Technische und Makromolekulare Chemie der Universität, Bundesstr. 45, D-20146 Hamburg, GermanySearch for more papers by this author
Matthias Berghahn

Matthias Berghahn

Institut für Technische und Makromolekulare Chemie der Universität, Bundesstr. 45, D-20146 Hamburg, Germany

Search for more papers by this author
First published: February 1995
Citations: 17

Abstract

Starting from commercial S- or R-3-bromo-2-methylpropanol, several new spacer diols were prepared. These spacers were polycondensed with the acid chloride of N-(4′-carboxyphenyl)trimellitimide. The resulting poly(ester-imide)s were characterized by elemental analyses, viscosity measurements, 1H-NMR spectroscopy, DSC- and WAXD-measurements and optical microscopy. The poly(ester-imide)s derived from chiral, aliphatic spacers form layer structures in the solid state, but no liquid crystalline phase. With nonsymmetrical, nonchiral semialiphatic spacers, poly(ester-imide)s were obtained, which form a smectic E or H phase in the solid state, a smectic-A or -C phase in the melt, and a nematic phase, when the spacer possesses an odd number of CH2 groups. The polycondensation of a chiral semialiphatic spacer yielded thermotropic poly(ester-imide)s with either S- or R-configuration. WAXD patterns measured with synchrotron radiation at various temperatures proved that a layer structure exists in the solid state (smectic-E* or H*) and a chiral smectic-A* or -C* phase plus a cholesteric phase in the melt. A 1 : 1 blend of the S- and R-polyesters was also studied, but did not show unusual features. © 1995 John Wiley & Sons, Inc.

The full text of this article hosted at iucr.org is unavailable due to technical difficulties.