Volume 3, Issue 1 e215
EDITORIAL
Free Access

Editorial

First published: 10 February 2021

It is a great pleasure to introduce the first issue of the third volume (2021) of Material Design & Processing Communications (MDPC). Since 2019, after two full years of intense activity, MDPC has attracted more than 120 papers from all over the world, now published in 12 issues.

The Journal aims to promote materials research advancing, the understanding and applicability of novel design methodologies, production technologies, failure prediction model technologies, structure–property relationships, characterization, monitoring, and standardization. The Journal links these topics featuring multidisciplinary, multiscale, and multimaterial research, which are highly relevant in current research. The choice of publishing short communications, short technical notes, and reports, which is a clear peculiarity of the Journal, has been very successful so far.

As Editor-in-Chief of the Journal, I want to thank all the section editors, the authors, and reviewers for their contribution to the journal and express my gratitude to the Wiley team for the valuable support during the last 2 years. I want also to thank all the editorial team members that have been constantly supporting the journal. As a result of these huge efforts, it is also a great pleasure to announce that MDPC will be indexed in Scopus starting from this year, and all the previous issues will be also indexed. This is a success that I want to share with all of you. This is only a first step, but it is a fundamental achievement for the growth and development of MDPC and for its consolidation. This should also motivate us to improve and to be more ambitious in the future.

Prof. Filippo Berto

Trondheim 14.12.2020

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