Research Article

Improvement in Mechanical Properties of 3D-Printed PEEK Structure by Nonsolvent Vapor Annealing

Wenhui Chen

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Xiaolong Zhang,

Xiaolong Zhang

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Di Tan,

Di Tan

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Peng Xu,

Peng Xu

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Baisong Yang,

Baisong Yang

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Kui Shi,

Kui Shi

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Bo Zhu,

Bo Zhu

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Quan Liu,

Quan Liu

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Yifeng Lei,

Yifeng Lei

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Sheng Liu,

Sheng Liu

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Longjian Xue,

Corresponding Author

Longjian Xue

[email protected]

orcid.org/0000-0001-5512-747X

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

E-mail: [email protected]

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Wenhui Chen,

Wenhui Chen

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Xiaolong Zhang,

Xiaolong Zhang

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Di Tan,

Di Tan

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Peng Xu,

Peng Xu

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Baisong Yang,

Baisong Yang

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Kui Shi,

Kui Shi

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Bo Zhu,

Bo Zhu

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Quan Liu,

Quan Liu

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Yifeng Lei,

Yifeng Lei

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Sheng Liu,

Sheng Liu

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

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Longjian Xue,

Corresponding Author

Longjian Xue

[email protected]

orcid.org/0000-0001-5512-747X

School of Power and Mechanical Engineering and Institute of Technological Science, Wuhan University, 8 South Donghu Road, Wuhan, 430072 China

E-mail: [email protected]

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First published: 09 February 2022

https://doi.org/10.1002/marc.202100874

Citations: 9

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Abstract

The broad applications of 3D-printed poly-ether-ether-ketone (3D-PEEK) structures are largely hampered by their inadequate mechanical properties that can be improved by post treatments. At present, thermal annealing is generally used to improve the mechanical properties of 3D-PEEK. However, it cannot simultaneously improve strength and ductility. Here, a cost-effective postprocessing method is developed to improve the mechanical properties of 3D-PEEK, based on annealing in nonsolvent vapor at room temperature. The annealing in nonsolvent vapor at room temperature simultaneously improves the strength, ductility, and fracture energy of as-printed 3D-PEEK by 22.6%, 151.3%, and 109.1%, respectively. The improved mechanical properties are attributed to enhanced interfacial bonding, increased crystallinity, decreased pinhole defects, and stress relaxation in the 3D-PEEK. Moreover, the annealing in both polar solvents (such as acetone and chloroform) and nonpolar solvents (such as n-hexane) are demonstrated to be effective for improving the mechanical properties of 3D-PEEK. The nonsolvent vapor-annealed 3D-PEEK can thus have potential applications in the fields of medical implants, automotive, aerospace, and more.

Conflict of Interest

The authors declare no conflict of interest.

Open Research

Data Availability Statement

Research data are not shared.

Supporting Information

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Volume43, Issue7

April 2022

2100874

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marc202100874-sup-0001-MovieS1.mp48.2 MB	Supporting Information
marc202100874-sup-0002-MovieS2.mp410.5 MB	Supporting Information
marc202100874-sup-0003-MovieS3.mp410.4 MB	Supporting Information
marc202100874-sup-0004-SuppMat.pdf744.2 KB	Supporting Information

Improvement in Mechanical Properties of 3D-Printed PEEK Structure by Nonsolvent Vapor Annealing

Abstract

Conflict of Interest

Open Research

Data Availability Statement

Supporting Information

References

Citing Literature

References

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Improvement in Mechanical Properties of 3D-Printed PEEK Structure by Nonsolvent Vapor Annealing

Abstract

Conflict of Interest

Open Research

Data Availability Statement

Supporting Information

References

Citing Literature

References

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