Achieving Hydrophobic Ultralow Dielectric Constant Polyimide Composites: Combined Efforts of Fluorination and Porous Fillers
Wanjing Zhao
Key Laboratory of Polymer Processing Engineering of Ministry of Education, Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640 P. R. China
Search for more papers by this authorChonghao Lu
Key Laboratory of Polymer Processing Engineering of Ministry of Education, Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640 P. R. China
Search for more papers by this authorHui Zhao
School of Chemistry and Chemical Engineering, College of Light Industry and Food Engineering, Guangxi University, Nanning, 530004 P. R. China
Search for more papers by this authorJingshu Huang
Key Laboratory of Polymer Processing Engineering of Ministry of Education, Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640 P. R. China
Search for more papers by this authorJun-Wei Zha
School of Chemistry and Biological Engineering, University of Science & Technology Beijing, Beijing, 100083 P. R. China
Shunde Graduate School of University of Science and Technology Beijing, Shunde, 528399 P. R. China
Search for more papers by this authorCorresponding Author
Xianwu Cao
Key Laboratory of Polymer Processing Engineering of Ministry of Education, Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorRobert K. Y. Li
Department of Materials Science and Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong SAR, 999077 P. R. China
Search for more papers by this authorCorresponding Author
Wei Wu
Jihua Laboratory, Foshan, Guangdong, 528200 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorWanjing Zhao
Key Laboratory of Polymer Processing Engineering of Ministry of Education, Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640 P. R. China
Search for more papers by this authorChonghao Lu
Key Laboratory of Polymer Processing Engineering of Ministry of Education, Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640 P. R. China
Search for more papers by this authorHui Zhao
School of Chemistry and Chemical Engineering, College of Light Industry and Food Engineering, Guangxi University, Nanning, 530004 P. R. China
Search for more papers by this authorJingshu Huang
Key Laboratory of Polymer Processing Engineering of Ministry of Education, Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640 P. R. China
Search for more papers by this authorJun-Wei Zha
School of Chemistry and Biological Engineering, University of Science & Technology Beijing, Beijing, 100083 P. R. China
Shunde Graduate School of University of Science and Technology Beijing, Shunde, 528399 P. R. China
Search for more papers by this authorCorresponding Author
Xianwu Cao
Key Laboratory of Polymer Processing Engineering of Ministry of Education, Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorRobert K. Y. Li
Department of Materials Science and Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong SAR, 999077 P. R. China
Search for more papers by this authorCorresponding Author
Wei Wu
Jihua Laboratory, Foshan, Guangdong, 528200 P. R. China
E-mail: [email protected]; [email protected]; [email protected]
Search for more papers by this authorAbstract
The advancement of the microelectronics industry necessitates the use of interlayer insulation materials with low dielectric constants and high mechanical properties. In this paper, a new type of copolymerized fluorinated polyimide (PI) is synthesized, and mixed with polyhedral oligomeric silsesquioxane (POSS) functionalized mesoporous silica (MCM-41@POSS). The PI/MCM-41@POSS composites exhibit good hydrophobicity. With the addition of 3 wt% MCM-41@POSS, the PI composite attained an ultralow dielectric constant (k = 1.88) and low dielectric loss (0.01) at 1 MHz, which is attributed to the mesoporous structure of MCM-41 and the restriction of polarization in the bonded region. The decorated POSS effectively prevents the penetration of PI molecular chains into the mesopores of MCM-41. In addition, the PI composites containing 3 wt% of MCM-41@POSS obtain the highest maximum stress of 104.03 MPa with an elongation at break of 13.73%. The hydrophobic PI composites with ultralow-k are expected to be good candidates as interlayer materials in microelectronics devices.
Conflict of Interest
The authors declare no conflict of interest.
Open Research
Data Availability Statement
Research data are not shared.
Supporting Information
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