Volume 29, Issue 31
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ChemInform Abstract: Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding

C. GUI

C. GUI

MESA Res. Inst., Univ. Twente, NL-7500 AE Enschede, Neth.

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M. ELWENSPOEK

M. ELWENSPOEK

MESA Res. Inst., Univ. Twente, NL-7500 AE Enschede, Neth.

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J. G. E. GARDENIERS

J. G. E. GARDENIERS

MESA Res. Inst., Univ. Twente, NL-7500 AE Enschede, Neth.

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P. V. LAMBECK

P. V. LAMBECK

MESA Res. Inst., Univ. Twente, NL-7500 AE Enschede, Neth.

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First published: 20 June 2010

Abstract

ChemInform is a weekly Abstracting Service, delivering concise information at a glance that was extracted from about 100 leading journals. To access a ChemInform Abstract of an article which was published elsewhere, please select a “Full Text” option. The original article is trackable via the “References” option.

ChemInform Abstract

[49 refs.].

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