Volume 141, Issue 35 e55882
RESEARCH ARTICLE

Development of poly(vinyl acetate) adhesive with hot water resistance via constructing semi-IPN/IPN structures with hydroxymethylated lignin

Jianchun Li

Jianchun Li

Research Institute of Wood Industry, Chinese Academy of Forestry, Beijing, China

Key Laboratory of Wood-Based Materials Science and Utilization, Beijing Forestry University, Beijing, China

Contribution: Data curation (equal), Methodology (supporting), Software (equal), Writing - original draft (equal), Writing - review & editing (supporting)

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Guoliang Chen

Guoliang Chen

Research Institute of Wood Industry, Chinese Academy of Forestry, Beijing, China

Key Laboratory of Wood-Based Materials Science and Utilization, Beijing Forestry University, Beijing, China

Contribution: Data curation (equal), Methodology (lead), Software (equal), Writing - original draft (equal), Writing - review & editing (supporting)

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Yanming Han

Corresponding Author

Yanming Han

Research Institute of Wood Industry, Chinese Academy of Forestry, Beijing, China

Correspondence

Yanming Han, Research Institute of Wood Industry, Chinese Academy of Forestry, Xiangshan Road, Beijing 100091, China.

Email: [email protected]

Wei Zhang, Key Laboratory of Wood-Based Materials Science and Utilization, Beijing Forestry University, No. 35 Tsinghua East Road, Haidian District, Beijing 100083, China.

Email: [email protected]

Contribution: Funding acquisition (equal), Methodology (supporting), Project administration (equal), Supervision (equal), Writing - review & editing (equal)

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Wei Zhang

Corresponding Author

Wei Zhang

Key Laboratory of Wood-Based Materials Science and Utilization, Beijing Forestry University, Beijing, China

Correspondence

Yanming Han, Research Institute of Wood Industry, Chinese Academy of Forestry, Xiangshan Road, Beijing 100091, China.

Email: [email protected]

Wei Zhang, Key Laboratory of Wood-Based Materials Science and Utilization, Beijing Forestry University, No. 35 Tsinghua East Road, Haidian District, Beijing 100083, China.

Email: [email protected]

Contribution: Funding acquisition (equal), Methodology (supporting), Project administration (equal), Supervision (equal), Writing - review & editing (equal)

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Shifeng Zhang

Shifeng Zhang

Key Laboratory of Wood-Based Materials Science and Utilization, Beijing Forestry University, Beijing, China

Contribution: Methodology (supporting), Supervision (equal), Writing - review & editing (equal)

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First published: 12 June 2024
Citations: 1

Jianchun Li and Guoliang Chen contributed to this work equally.

Abstract

Poly(vinyl acetate) (PVAc) adhesive is often used in the wood industry because it can be rapidly cured at room temperature to produce a high bonding strength. However, PVAc is a linear polymer susceptible to thermal creep, so it will fail to bond in high temperature and humidity environments. In this study, the hot water resistance of PVAc adhesive is improved by introducing lignin with a complex structure to construct multiple cross-linked networks with a high cross-link. However, due to the large steric hindrance, the reactivity of lignin hydroxyl groups is low. In the process of preparing adhesive, alkali lignin is hydroxymethylated to improve its reactivity, and then 4,4′-diphenylmethane diisocyanate is used as a cross-linker to construct interpenetrating and semi-interpenetrating polymer networks. The hydroxymethylation occurs through the reaction of formaldehyde with lignin under alkaline conditions. Optimal reaction conditions include a reaction ratio of 0.20, a reaction temperature of 80°C, and a reaction time of 3.5 h. On those conditions, the bonding strength of the lignin-based PVAc adhesive reaches 1.8 MPa after hot-water treatment. Therefore, the lignin-based hot water-resistant PVAc adhesive has shown good application potential in high temperature and humidity environments.

CONFLICT OF INTEREST STATEMENT

The authors declare no conflicts of interest.

DATA AVAILABILITY STATEMENT

The data that support the findings of this study are available from the corresponding author upon reasonable request.

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