Article

Rheological behavior of ethylene–vinyl acetate copolymer and fabrication of micropyramid arrays by roll-to-roll hot embossing on its thin films

Wenjun Li

State Key Laboratory of Metal Matrix Composites, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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Shiqiang Song,

Shiqiang Song

State Key Laboratory of Metal Matrix Composites, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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Yinghao Zhai,

Yinghao Zhai

State Key Laboratory of Metal Matrix Composites, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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Yong Zhang,

Corresponding Author

Yong Zhang

[email protected]

State Key Laboratory of Metal Matrix Composites, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

Correspondence to: Y. Zhang (E-mail: [email protected])Search for more papers by this author

Peiyun Yi,

Peiyun Yi

Shanghai Key Laboratory of Digital Manufacture for Thin-walled Structures, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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Xinmin Lai,

Xinmin Lai

Shanghai Key Laboratory of Digital Manufacture for Thin-walled Structures, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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Wenjun Li,

Wenjun Li

State Key Laboratory of Metal Matrix Composites, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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Shiqiang Song,

Shiqiang Song

State Key Laboratory of Metal Matrix Composites, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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Yinghao Zhai,

Yinghao Zhai

State Key Laboratory of Metal Matrix Composites, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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Yong Zhang,

Corresponding Author

Yong Zhang

[email protected]

State Key Laboratory of Metal Matrix Composites, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

Correspondence to: Y. Zhang (E-mail: [email protected])Search for more papers by this author

Peiyun Yi,

Peiyun Yi

Shanghai Key Laboratory of Digital Manufacture for Thin-walled Structures, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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Xinmin Lai,

Xinmin Lai

Shanghai Key Laboratory of Digital Manufacture for Thin-walled Structures, Shanghai Jiao Tong University, Shanghai, 200240 People's Republic of China

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First published: 07 May 2017

https://doi.org/10.1002/app.45228

Citations: 3

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ABSTRACT

Films of ethylene–vinyl acetate (EVA) copolymer with different vinyl acetate (VA) contents were adopted as flexible substrates for fabrication of micropyramid arrays by roll-to-roll (R2R) hot embossing at roller temperatures 40–80 °C. An empirical relationship between rheological behavior of EVA in rubbery state and demolding performance of the films was explored. Dependence of average forming height of micropyramid arrays on VA content and roller temperatures was investigated. Our study showed that both viscosity and relaxation behavior of EVA can be related to the ultimate forming height of micropyramids. The relationships can provide references for experimental research and industrial manufacture on R2R hot embossing. Retroreflection of micropyramid arrays was observed and transmittances of the two sides of embossed films were studied. Transmittances of the VA28 film embossed at 60 °C were 97.9% (the embossed side) and 41.8% (the smooth side), which showed potential applications in reflective film and antireflective film fields. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017, 134, 45228.

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Volume134, Issue34

September 10, 2017

45228

Rheological behavior of ethylene–vinyl acetate copolymer and fabrication of micropyramid arrays by roll-to-roll hot embossing on its thin films

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Rheological behavior of ethylene–vinyl acetate copolymer and fabrication of micropyramid arrays by roll-to-roll hot embossing on its thin films

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